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TLC320AD57CDWR

Texas Instruments

TLC320AD57CDWR by Texas Instruments

TLC320AD57CDWR by Texas Instruments is an 18-bit ADC with a sample rate of 0.48 MHz and operates at a supply voltage of 5V. It is used in applications requiring high-resolution analog-to-digital conversion, such as industrial automation and medical devices due to its small outline package and serial output format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,147 parts In-Stock

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2,147

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Digiode

USA . 1,885 parts In-Stock

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1,885

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,643 parts In-Stock

1+ parts

$5.000

100+ parts

-

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1,643

$5.000

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AZTECH Wire

Italy . 880 parts In-Stock

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$10.437

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880

$10.437

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Parana Technologies

USA . 1,633 parts In-Stock

1+ parts

$21.522

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$21.905

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1,633

$21.522

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$21.905

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DigiPath Technology Company

USA . 547 parts In-Stock

1+ parts

$23.698

100+ parts

$21.802

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547

$23.698

$21.802

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ChromeModa Solutions

Germany . 6,658 parts In-Stock

1+ parts

$24.182

100+ parts

$19.829

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6,658

$24.182

$19.829

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IDEA Electronic Components Group

UK . 592 parts In-Stock

1+ parts

$24.182

100+ parts

$22.973

1k+ parts

$21.764

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592

$24.182

$22.973

$21.764

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Corphita

USA . 1,507 parts In-Stock

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1,507

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Overview

Unlock the power of precise analog-to-digital conversion with the TLC320AD57CDWR by Texas Instruments. Known for their top-quality products, Texas Instruments delivers exceptional performance and reliability in every component. Ideal for a wide range of applications, this ADC offers unmatched value and benefits to customers seeking accurate data capture. Experience seamless integration and high-speed sampling with the TLC320AD57CDWR, setting new standards in digital signal processing. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

No. of Bits: 18

Allows for high-resolution conversion of analog signals to digital, providing precise and accurate data.

Power Supplies (V): 5

Operates on a common voltage supply, making it compatible with standard power sources.

Sample Rate: 0.48 MHz

High sampling rate allows for fast and efficient conversion of signals, capturing data quickly and accurately.

Maximum Operating Temperature: 70 °C

Can operate efficiently in a wide range of temperatures, suitable for various environments.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Analog-to-Digital Converters TLC320AD57CDWR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

18

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Sample Rate:

480 kHz

Electrical Specifications

Power Supplies:

5 V

Maximum Analog Input Voltage:

0 mV

Nominal Supply Voltage:

5 V

Maximum Supply Current:

32 mA

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.705 in (17.9 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP28,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

Trade Compliance

TLC320AD57CDWR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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