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TLC3541IDGKRG4

Texas Instruments

TLC3541IDGKRG4 by Texas Instruments

TLC3541IDGKRG4 by Texas Instruments is a 14-bit ADC with 0.0061% EL, 5V supply, and 0.2 MHz sample rate. Ideal for industrial applications, it features a small outline package with dual terminals and GULL WING form.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,240 parts In-Stock

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5,240

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Digiode

USA . 1,936 parts In-Stock

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1,936

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Chip Stock

USA . 445 parts In-Stock

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445

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Nova Conductors

Japan . 86 parts In-Stock

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86

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Distributors (Availability)

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One Stop Electronics

USA . 684 parts In-Stock

1+ parts

$1.000

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684

$1.000

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Parana Technologies

USA . 527 parts In-Stock

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$7.551

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-

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$8.061

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527

$7.551

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$8.061

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DigiPath Technology Company

USA . 1,870 parts In-Stock

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$8.314

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1,870

$8.314

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ChromeModa Solutions

Germany . 3,256 parts In-Stock

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$8.484

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$6.957

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3,256

$8.484

$6.957

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IDEA Electronic Components Group

UK . 320 parts In-Stock

1+ parts

$8.484

100+ parts

$8.060

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$7.636

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320

$8.484

$8.060

$7.636

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Corohmni

South Africa . 19 parts In-Stock

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$10.387

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19

$10.387

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AZTECH Wire

Italy . 805 parts In-Stock

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$14.918

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805

$14.918

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Ampacity Inc.

Singapore . 572 parts In-Stock

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$30.000

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572

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Argo Parts USA

USA . 2,988 parts In-Stock

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Corphita

USA . 1,603 parts In-Stock

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Bastille Electronics

Australia . 870 parts In-Stock

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Continental Prestige Electronics

USA . 144 parts In-Stock

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144

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Overview

Elevate your analog-to-digital conversion experience with the TLC3541IDGKRG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers unparalleled quality and reliability. This ADC is perfect for a wide range of applications, providing precise and efficient conversion with minimal linearity error. With a compact design and industrial-grade temperature range, the TLC3541IDGKRG4 offers unmatched value and performance. Upgrade your projects with this top-of-the-line converter and experience the difference Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, making it suitable for a wide range of applications.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board.

No. of Bits: 14

High resolution with 14 bits for accurate digital conversion of analog signals.

Power Supplies (V): 5

Standard power supply voltage of 5V for compatibility with most systems.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of -40 to 85°C for versatility in different environments.

Maximum Conversion Time: 2.67 us

Fast conversion time of 2.67 microseconds for quick processing of analog data.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation analog-to-digital converter for high accuracy and fast conversion rates.

Technical Specifications

Analog-to-Digital Converters TLC3541IDGKRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0061 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.67 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP8,.19

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G8

Qualified:

No

Trade Compliance

TLC3541IDGKRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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