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TLC3544CPWRG4

Texas Instruments

TLC3544CPWRG4 by Texas Instruments

TLC3544CPWRG4 by Texas Instruments is a 14-bit ADC with 0.0061% linearity error, 4 analog in channels, and 0.2 MHz sample rate. Ideal for applications requiring precise analog-to-digital conversion such as industrial automation and sensor interfacing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,309 parts In-Stock

1+ parts

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4,309

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Digiode

USA . 3,411 parts In-Stock

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3,411

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 443 parts In-Stock

1+ parts

$8.293

100+ parts

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443

$8.293

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Parana Technologies

USA . 417 parts In-Stock

1+ parts

$12.718

100+ parts

-

1k+ parts

$13.184

10k+ parts

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417

$12.718

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$13.184

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ChromeModa Solutions

Germany . 2,242 parts In-Stock

1+ parts

$14.290

100+ parts

$11.718

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2,242

$14.290

$11.718

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IDEA Electronic Components Group

UK . 125 parts In-Stock

1+ parts

$14.290

100+ parts

$13.576

1k+ parts

$12.861

10k+ parts

-

125

$14.290

$13.576

$12.861

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One Stop Electronics

USA . 1,083 parts In-Stock

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$25.000

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1,083

$25.000

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Corphita

USA . 3,511 parts In-Stock

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3,511

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DigiPath Technology Company

USA . 1,863 parts In-Stock

1+ parts

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$12.884

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1,863

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$12.884

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Overview

Discover the Texas Instruments TLC3544CPWRG4 Analog-to-Digital Converter, a high-quality product offering precise conversion capabilities for your electronic projects. With Texas Instruments' reputation for excellence in manufacturing, this ADC boasts superior performance and reliability. Ideal for applications requiring accurate analog signal conversion, this converter provides value by delivering fast and efficient results. Upgrade your designs with the TLC3544CPWRG4 and experience the benefits of top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various applications.

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple inputs to be converted simultaneously, increasing efficiency and flexibility.

Surface Mount: YES

Surface mount capability makes installation and integration easier, saving time and effort during assembly.

No. of Bits: 14

14-bit resolution ensures accurate conversion of analog input signals to digital output, providing high precision data.

Power Supplies (V): 3/5,5

Support for multiple power supply voltages (3V and 5.5V) offers compatibility with various systems and requirements.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance of 70°C ensures reliable performance even in demanding environmental conditions.

Technology: CMOS

CMOS technology helps in reducing power consumption and offers high-speed operation, enhancing overall efficiency of the product.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold feature ensures accurate sampling of analog signals at the input, resulting in precise digital conversion output.

Technical Specifications

Analog-to-Digital Converters TLC3544CPWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0061 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.785 µs

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

4.07 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP20,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC3544CPWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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