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TLC3544CPWG4

Texas Instruments

TLC3544CPWG4 by Texas Instruments

TLC3544CPWG4 by Texas Instruments is a 14-bit ADC with 0.0061% EL, 4 analog in channels, and 2.785us conversion time. Ideal for applications requiring high precision data acquisition in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,948 parts In-Stock

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3,948

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Vyrian

USA . 3,869 parts In-Stock

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Euro-Tech

UK . 62 parts In-Stock

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62

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 669 parts In-Stock

1+ parts

$17.180

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669

$17.180

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Parana Technologies

USA . 1,841 parts In-Stock

1+ parts

$21.510

100+ parts

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$21.896

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1,841

$21.510

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$21.896

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One Stop Electronics

USA . 522 parts In-Stock

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$22.000

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522

$22.000

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DigiPath Technology Company

USA . 393 parts In-Stock

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$23.686

100+ parts

$21.791

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393

$23.686

$21.791

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ChromeModa Solutions

Germany . 1,814 parts In-Stock

1+ parts

$24.169

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$19.819

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1,814

$24.169

$19.819

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IDEA Electronic Components Group

UK . 227 parts In-Stock

1+ parts

$24.169

100+ parts

$22.961

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$21.752

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227

$24.169

$22.961

$21.752

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Corphita

USA . 3,097 parts In-Stock

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Microchip USA

USA . 2,416 parts In-Stock

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Overview

Experience unmatched precision and reliability with the TLC3544CPWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional Analog-to-Digital Converters like no other. This versatile product is perfect for a wide range of applications, offering customers unparalleled value and performance. Whether you're looking to enhance your audio equipment or improve sensor systems, the TLC3544CPWG4 provides the quality and benefits you need to take your projects to the next level. Trust Texas Instruments for superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package makes the product lightweight and durable, suitable for different applications.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile connectivity, enabling the converter to handle multiple input signals simultaneously.

Surface Mount: YES

The surface mount feature makes installation and placement of the converter convenient and efficient in various electronic devices.

No. of Bits: 14

The higher number of bits (14) ensures a higher resolution and accuracy in converting analog signals to digital data.

Power Supplies (V): 3/5,5

The availability of multiple power supply options (3V and 5.5V) adds flexibility in integrating the converter into different power systems.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making the converter efficient and reliable for various applications.

Technical Specifications

Analog-to-Digital Converters TLC3544CPWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0061 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.785 µs

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

4.07 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

3.6 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP20,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC3544CPWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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