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TL3695DRG4

Texas Instruments

TL3695DRG4 by Texas Instruments

TL3695DRG4 by Texas Instruments is a Line Driver & Receiver with 8 terminals, operating at 5V. It features a max transmit delay of 22ns and differential output interface for EIA-422-B, TIA-422-B, EIA-485-A, TIA-485-A, V.11 standards. Ideal for commercial applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,635 parts In-Stock

1+ parts

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3,635

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Vyrian

USA . 3,526 parts In-Stock

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3,526

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Bristol Electronics

USA . 68 parts In-Stock

1+ parts

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68

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 883 parts In-Stock

1+ parts

$8.132

100+ parts

-

1k+ parts

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883

$8.132

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Parana Technologies

USA . 1,730 parts In-Stock

1+ parts

$10.709

100+ parts

-

1k+ parts

$11.194

10k+ parts

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1,730

$10.709

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$11.194

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DigiPath Technology Company

USA . 2,378 parts In-Stock

1+ parts

$11.792

100+ parts

$10.849

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2,378

$11.792

$10.849

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ChromeModa Solutions

Germany . 5,706 parts In-Stock

1+ parts

$12.033

100+ parts

$9.867

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5,706

$12.033

$9.867

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IDEA Electronic Components Group

UK . 1,532 parts In-Stock

1+ parts

$12.033

100+ parts

$11.431

1k+ parts

$10.830

10k+ parts

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1,532

$12.033

$11.431

$10.830

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One Stop Electronics

USA . 250 parts In-Stock

1+ parts

$25.500

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250

$25.500

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Component Stockers USA

USA . 781 parts In-Stock

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$99.990

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781

$99.990

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Microchip USA

USA . 4,518 parts In-Stock

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4,518

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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A-Z Elektronik GmbH

Germany . 1,608 parts In-Stock

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1,608

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Corphita

USA . 1,258 parts In-Stock

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1,258

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Overview

Upgrade your communication systems with the TL3695DRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees quality and reliability in their products. The TL3695DRG4 falls under the Line Drivers & Receivers category, offering seamless data transmission and reception. With a compact package shape and dual terminal position, this product is versatile and easy to install. Experience quick transmit and receive delays, high-level input current, and differential output for optimal performance. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external elements, making the product suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on PCBs, making it convenient for design and assembly processes.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage capability provides flexibility in power input options, ensuring compatibility with various systems.

Maximum Transmit Delay: 22 ns

The low transmit delay ensures fast signal transmission, making the product suitable for high-speed communication applications.

Power Supplies (V): 5

The standard power supply voltage of 5V simplifies compatibility with common power sources and ensures stability in operation.

Maximum High Level Input Current: 0.00002 Amp

The low input current requirement helps in efficient power usage and minimizes heat generation, contributing to energy efficiency.

Maximum Output Low Current: 16 Amp

The high output current capability allows for driving power-hungry loads or long transmission lines without signal degradation, ensuring reliable performance.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature range ensures reliable operation in standard operating environments, making it suitable for a wide range of applications.

Interface Standard: EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11

Support for multiple interface standards enables compatibility with various communication protocols, increasing the product's versatility.

Technology: TTL

Utilizing TTL technology ensures reliable signal processing and compatibility with TTL logic levels, making it a dependable choice for digital communication systems.

Technical Specifications

Line Drivers & Receivers TL3695DRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

TRISTATABLE RECEIVER; COMMON I/O; 1 RECEIVER ACTIVE UNDER SHUTDOWN

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

16 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

37 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

22 ns

Width:

3.9 mm

Trade Compliance

TL3695DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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