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TL3695D-00

Texas Instruments

TL3695D-00 by Texas Instruments

TL3695D-00 by Texas Instruments is a Line Driver & Receiver with 8 terminals, operating at 4.75-5.25 V. It features 22 ns max transmit delay and 37 ns max receive delay, suitable for V.11, X.27, EIA-422-A, and EIA-485 interfaces in commercial temperature range applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,229 parts In-Stock

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Digiode

USA . 1,686 parts In-Stock

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1,686

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 472 parts In-Stock

1+ parts

$9.306

100+ parts

-

1k+ parts

$9.932

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472

$9.306

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$9.932

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DigiPath Technology Company

USA . 649 parts In-Stock

1+ parts

$10.247

100+ parts

$9.427

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649

$10.247

$9.427

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ChromeModa Solutions

Germany . 3,995 parts In-Stock

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$10.456

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$8.574

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3,995

$10.456

$8.574

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IDEA Electronic Components Group

UK . 964 parts In-Stock

1+ parts

$10.456

100+ parts

$9.933

1k+ parts

$9.410

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964

$10.456

$9.933

$9.410

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AZTECH Wire

Italy . 332 parts In-Stock

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$18.999

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332

$18.999

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One Stop Electronics

USA . 1,167 parts In-Stock

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$50.500

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$50.500

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Corphita

USA . 270 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the TL3695D-00 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability. Ideal for Line Drivers & Receivers applications, this product offers customers the value of efficient signal processing and enhanced connectivity. With a compact design and advanced technology, the TL3695D-00 ensures maximum performance and compatibility. Experience the benefits of faster data transfer speeds and improved efficiency with this innovative solution. Elevate your projects to the next level with Texas Instruments TL3695D-00.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and long-lasting performance of the product.

Surface Mount: YES

Surface mount capability allows for easier installation and integration into electronic circuits.

Maximum Supply Voltage: 5.25 V

Can handle higher supply voltages, providing flexibility in power requirements.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a circuit board.

Maximum Transmit Delay: 22 ns

Low transmit delay ensures fast and efficient data transmission.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components in a circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for compact circuit designs.

Minimum Supply Voltage: 4.75 V

Can operate at low supply voltages, making it suitable for a wide range of applications.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliability in various environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for flexible control of the output signal, enhancing versatility.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures, making it suitable for a variety of environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures reliable connectivity.

Maximum Seated Height: 1.75 mm

Low seated height allows for compact circuit board designs.

Width: 3.9 mm

Narrow width saves space on a circuit board.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures accurate signal transmission.

Differential Output: YES

Differential output reduces noise and improves signal integrity.

Length: 4.9 mm

Compact length allows for efficient use of space on a circuit board.

Temperature Grade: COMMERCIAL

Commercial-grade temperature tolerance makes it suitable for standard operating conditions.

Maximum Receive Delay: 37 ns

Low receive delay ensures fast data reception and processing.

Technology: BIPOLAR

Bipolar technology provides stable and reliable performance in signal processing.

Terminal Form: GULL WING

Gull wing terminal form makes it easier to solder onto a circuit board.

Interface Standard: V.11; X.27; EIA-422-A; EIA-485

Compliance with multiple interface standards allows for compatibility with various systems.

Maximum Supply Current: 50 mA

Low supply current requirement helps in reducing power consumption.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input ensures robust signal detection and noise immunity.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage makes it compatible with many electronic systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy connectivity with other components on a circuit board.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type allows for bidirectional communication between systems.

Technical Specifications

Line Drivers & Receivers TL3695D-00 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

TRISTATABLE RECEIVER; COMMON I/O; 1 RECEIVER ACTIVE UNDER SHUTDOWN

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

V.11; X.27; EIA-422-A; EIA-485

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Receive Delay:

37 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

22 ns

Width:

3.9 mm

Trade Compliance

TL3695D-00 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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