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TL3695DG

Texas Instruments

TL3695DG by Texas Instruments

TL3695DG by Texas Instruments is a Line Driver & Receiver with 8 terminals, operating at 5V. It features a max output low current of 16A and differential output capability. Ideal for commercial applications requiring fast signal transmission with minimal delay up to 37ns.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,766 parts In-Stock

1+ parts

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8,766

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Digiode

USA . 1,448 parts In-Stock

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-

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1,448

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 792 parts In-Stock

1+ parts

$5.894

100+ parts

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792

$5.894

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Parana Technologies

USA . 378 parts In-Stock

1+ parts

$6.550

100+ parts

-

1k+ parts

$7.293

10k+ parts

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378

$6.550

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$7.293

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DigiPath Technology Company

USA . 2,347 parts In-Stock

1+ parts

$7.213

100+ parts

-

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2,347

$7.213

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ChromeModa Solutions

Germany . 6,278 parts In-Stock

1+ parts

$7.360

100+ parts

$6.035

1k+ parts

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6,278

$7.360

$6.035

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IDEA Electronic Components Group

UK . 126 parts In-Stock

1+ parts

$7.360

100+ parts

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1k+ parts

$6.624

10k+ parts

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126

$7.360

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$6.624

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One Stop Electronics

USA . 1,600 parts In-Stock

1+ parts

$27.500

100+ parts

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1,600

$27.500

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Corphita

USA . 4,239 parts In-Stock

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4,239

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Overview

Experience reliable and efficient signal transmission with the TL3695DG from Texas Instruments. Crafted with precision and expertise, this line driver/receiver offers unparalleled quality and performance in a compact package. Ideal for a variety of applications, this product ensures seamless communication with minimal power consumption. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Elevate your projects with the TL3695DG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight construction for the product.

Surface Mount: YES

Facilitates easier and more efficient installation of the product onto circuit boards.

Power Supplies (V): 5

Operates effectively at a common voltage level, making it compatible with standard power sources.

Maximum Operating Temperature: 70 °C

Can withstand relatively high temperatures, ensuring reliable performance in varying environmental conditions.

Differential Output: YES

Provides balanced signaling for better noise immunity and signal integrity in data transmission.

Technology: BIPOLAR

Utilizes bipolar technology for efficient signal processing and transmission.

Nominal Supply Voltage: 5 V

Works efficiently at a standard voltage level, ensuring compatibility with typical power supplies.

Technical Specifications

Line Drivers & Receivers TL3695DG attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

16 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

37 ns

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

50 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TL3695DG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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