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TL3695DE4

Texas Instruments

TL3695DE4 by Texas Instruments

TL3695DE4 by Texas Instruments is a Line Driver & Receiver with 8 terminals, operating at 5V. It features a max transmit delay of 22ns and differential outputs, suitable for EIA-422-B, TIA-422-B, EIA-485-A, TIA-485-A, V.11 interfaces. Ideal for applications requiring fast signal transmission in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,451 parts In-Stock

1+ parts

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8,451

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Digiode

USA . 649 parts In-Stock

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649

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,475 parts In-Stock

1+ parts

$7.102

100+ parts

-

1k+ parts

$7.626

10k+ parts

-

1,475

$7.102

-

$7.626

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DigiPath Technology Company

USA . 2,336 parts In-Stock

1+ parts

$7.820

100+ parts

-

1k+ parts

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2,336

$7.820

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IDEA Electronic Components Group

UK . 1,792 parts In-Stock

1+ parts

$7.980

100+ parts

-

1k+ parts

$7.182

10k+ parts

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1,792

$7.980

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$7.182

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ChromeModa Solutions

Germany . 490 parts In-Stock

1+ parts

$7.980

100+ parts

$6.544

1k+ parts

-

10k+ parts

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490

$7.980

$6.544

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One Stop Electronics

USA . 831 parts In-Stock

1+ parts

$8.500

100+ parts

-

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831

$8.500

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AZTECH Wire

Italy . 256 parts In-Stock

1+ parts

$12.025

100+ parts

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256

$12.025

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Corphita

USA . 4,855 parts In-Stock

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4,855

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Perfect Parts

USA . 416 parts In-Stock

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416

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Overview

Enhance your circuit designs with the TL3695DE4 by Texas Instruments, a top-of-the-line line driver and receiver that delivers superior performance and reliability. Manufactured by the reputable Texas Instruments, known for their high-quality electronic components, this product is ideal for a wide range of applications. With its compact package body material and surface mount capabilities, this line driver offers customers exceptional value and benefits. Experience fast transmit delays, low output currents, and a wide operating temperature range, making it the perfect choice for your projects. Upgrade your electronics with the TL3695DE4 and enjoy seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into electronic circuit boards.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with a wide range of systems and applications.

Maximum Transmit Delay: 22 ns

The low transmit delay ensures quick and efficient data transmission.

Power Supplies (V): 5

The 5V power supply is a common and readily available voltage, making it easy to power the device.

No. of Terminals: 8

Having 8 terminals allows for versatile connections and interfacing with other devices.

Maximum High Level Input Current: 0.00002 Amp

The low input current helps in reducing power consumption and heat generation.

Minimum Supply Voltage: 4.75 V

The minimum supply voltage ensures proper functioning even under low voltage conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the device can operate reliably in various environmental conditions.

Output Characteristics: 3-STATE

The 3-STATE output allows for flexible control of the output signals, enabling tri-state logic operation.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C means the device can start up and operate in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Maximum Seated Height: 1.75 mm

The low seated height allows for compact and space-efficient designs.

Width: 3.9 mm

The compact width makes the product suitable for applications with limited space constraints.

Maximum Output Low Current: 16 Amp

The high output low current capability allows for driving a variety of loads with ease.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies interfacing with other devices and circuits.

Differential Output: YES

Differential output signals help in reducing electromagnetic interference and improving signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering and assembly of the device during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the device can withstand the soldering process.

Length: 4.9 mm

The compact length of the product makes it suitable for applications with space constraints.

Minimum Out Swing: 1.5 V

The minimum out swing ensures reliable signal output levels for proper communication with other devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade makes the product suitable for standard operating temperature ranges encountered in commercial applications.

Maximum Receive Delay: 37 ns

The low receive delay ensures minimal latency in receiving data signals, improving overall system performance.

Technology: TTL

TTL technology provides reliable digital signal processing, commonly used in various electronic applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and assembly processes during installation.

Interface Standard: EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11

Compatibility with multiple interface standards allows for versatile connectivity options in different communication systems.

Maximum Supply Current: 50 mA

The low maximum supply current requirement helps in minimizing power consumption and heat dissipation.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The differential Schmitt trigger input characteristics ensure robust and noise-immune signal reception.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage simplifies power requirements and compatibility with standard power sources.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy connections and compatibility with common PCB designs.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type enables bidirectional communication between different systems or devices.

Technical Specifications

Line Drivers & Receivers TL3695DE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

TRISTATABLE RECEIVER; COMMON I/O; 1 RECEIVER ACTIVE UNDER SHUTDOWN

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

16 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

37 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

22 ns

Width:

3.9 mm

Trade Compliance

TL3695DE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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