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TL3695P-00

Texas Instruments

TL3695P-00 by Texas Instruments

TL3695P-00 by Texas Instruments is a Line Driver & Receiver with 8 terminals. It operates at 4.75-5.25 V, -40 to 85°C, and has a transmit delay of 22 ns. Ideal for V.11, X.27, EIA-422-A, and EIA-485 interfaces in various applications requiring bipolar technology and differential outputs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,899 parts In-Stock

1+ parts

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100+ parts

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3,899

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Digiode

USA . 2,969 parts In-Stock

1+ parts

-

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-

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2,969

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 334 parts In-Stock

1+ parts

$0.500

100+ parts

-

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334

$0.500

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AZTECH Wire

Italy . 449 parts In-Stock

1+ parts

$7.515

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449

$7.515

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Parana Technologies

USA . 2,037 parts In-Stock

1+ parts

$12.856

100+ parts

-

1k+ parts

$13.333

10k+ parts

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2,037

$12.856

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$13.333

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ChromeModa Solutions

Germany . 70 parts In-Stock

1+ parts

$14.445

100+ parts

$11.845

1k+ parts

-

10k+ parts

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70

$14.445

$11.845

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IDEA Electronic Components Group

UK . 52 parts In-Stock

1+ parts

$14.445

100+ parts

$13.723

1k+ parts

$13.000

10k+ parts

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52

$14.445

$13.723

$13.000

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Corphita

USA . 404 parts In-Stock

1+ parts

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404

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DigiPath Technology Company

USA . 55 parts In-Stock

1+ parts

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100+ parts

$13.024

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55

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$13.024

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Overview

Enhance your electronic designs with the TL3695P-00 from Texas Instruments, a leading manufacturer in the industry. Ideal for Line Drivers & Receivers applications, this high-quality product offers reliable performance and seamless integration. With fast transmit and receive delays, dual terminal positions, and differential outputs, it provides unmatched value and benefits to customers. Trust Texas Instruments to deliver top-notch technology in a compact package that meets your commercial needs. Elevate your projects with the TL3695P-00 and experience excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the components inside, making the product reliable for long-term use.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power input and ensures stable performance within the specified range.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and installation in various electronic devices or systems.

Maximum Transmit Delay: 22 ns

The low transmit delay ensures quick and efficient data transmission, making the product suitable for high-speed applications.

No. of Terminals: 8

The ample number of terminals provide connectivity options for various input and output devices, enhancing the product's versatility.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance when not in use, reducing power consumption and preventing data conflicts within a system.

Technology: BIPOLAR

The bipolar technology ensures reliable signal transmission and reception, making the product suitable for demanding industrial environments.

Interface Standard: V.11; X.27; EIA-422-A; EIA-485

The support for multiple interface standards allows compatibility with a wide range of devices and systems, increasing the product's usability.

Technical Specifications

Line Drivers & Receivers TL3695P-00 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

TRISTATABLE RECEIVER; COMMON I/O; 1 RECEIVER ACTIVE UNDER SHUTDOWN

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

V.11; X.27; EIA-422-A; EIA-485

JESD-30 Code:

R-PDIP-T8

Length:

9.81 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Receive Delay:

37 ns

Receiver No. of Bits:

1

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

22 ns

Width:

7.62 mm

Trade Compliance

TL3695P-00 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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