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TL3695DRE4

Texas Instruments

TL3695DRE4 by Texas Instruments

TL3695DRE4 by Texas Instruments is a Line Driver & Receiver with 8 terminals, operating at 5V. It features a max supply voltage of 5.25V, transmit delay of 22ns, and output polarity as complementary. Ideal for applications requiring EIA-422-B, TIA-422-B, EIA-485-A, TIA-485-A or V.11 interface standards in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,793 parts In-Stock

1+ parts

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4,793

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Digiode

USA . 1,182 parts In-Stock

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1,182

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 493 parts In-Stock

1+ parts

$5.478

100+ parts

-

1k+ parts

$6.208

10k+ parts

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493

$5.478

-

$6.208

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DigiPath Technology Company

USA . 2,097 parts In-Stock

1+ parts

$6.032

100+ parts

$5.549

1k+ parts

-

10k+ parts

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2,097

$6.032

$5.549

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ChromeModa Solutions

Germany . 5,294 parts In-Stock

1+ parts

$6.155

100+ parts

$5.047

1k+ parts

-

10k+ parts

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5,294

$6.155

$5.047

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IDEA Electronic Components Group

UK . 739 parts In-Stock

1+ parts

$6.155

100+ parts

-

1k+ parts

$5.540

10k+ parts

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739

$6.155

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$5.540

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One Stop Electronics

USA . 436 parts In-Stock

1+ parts

$7.500

100+ parts

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436

$7.500

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AZTECH Wire

Italy . 806 parts In-Stock

1+ parts

$16.871

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806

$16.871

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Corphita

USA . 4,408 parts In-Stock

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4,408

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Overview

Experience unparalleled performance and reliability with the TL3695DRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments has delivered yet another exceptional product in the category of Line Drivers & Receivers. This small outline package boasts a wide range of applications and features, making it a versatile solution for your needs. With a maximum supply voltage of 5.25V and 3-STATE output characteristics, the TL3695DRE4 offers high-quality performance at an affordable price. Trust Texas Instruments to provide you with cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the line driver & receiver.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

Can handle a wide range of supply voltages, making it versatile for various applications.

Output Characteristics: 3-STATE

Allows the output to be in three different states, providing flexibility in controlling the communication line.

Maximum Operating Temperature: 70 °C

Capable of operating in a wide range of temperatures, suitable for different environmental conditions.

Interface Standard: EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11

Complies with multiple industry standards, ensuring compatibility with various systems and devices.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides a reliable and corrosion-resistant connection for the terminals, ensuring long-term performance.

Technical Specifications

Line Drivers & Receivers TL3695DRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

TRISTATABLE RECEIVER; COMMON I/O; 1 RECEIVER ACTIVE UNDER SHUTDOWN

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

16 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

37 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

22 ns

Width:

3.9 mm

Trade Compliance

TL3695DRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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