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TL16C550DIPTRG4

Texas Instruments

TL16C550DIPTRG4 by Texas Instruments

TL16C550DIPTRG4 by Texas Instruments is a Serial Communication Controller with 48 terminals, operating at 24 MHz clock frequency. It supports data transfer rate of 0.1875 MBps and communication protocols like ASYNC and BIT. Ideal for industrial applications requiring high-speed serial IO/communication control.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,312 parts In-Stock

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Digiode

USA . 2,200 parts In-Stock

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Goldney Electronics S.L.

Spain . 963 parts In-Stock

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AZTECH Wire

Italy . 373 parts In-Stock

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$10.051

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$10.051

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Parana Technologies

USA . 1,310 parts In-Stock

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$14.998

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$15.421

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$14.998

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DigiPath Technology Company

USA . 116 parts In-Stock

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$16.515

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$15.194

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$16.515

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ChromeModa Solutions

Germany . 1,553 parts In-Stock

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$16.852

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$13.819

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$16.852

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IDEA Electronic Components Group

UK . 205 parts In-Stock

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$16.852

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$16.009

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$15.167

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205

$16.852

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One Stop Electronics

USA . 1,311 parts In-Stock

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$33.000

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Microchip USA

USA . 10,607 parts In-Stock

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Lixinc

USA . 9,646 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,264 parts In-Stock

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Corphita

USA . 2,150 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Elevate your communication capabilities with the TL16C550DIPTRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Serial Communication Controllers that redefine efficiency and reliability. Ideal for a wide range of applications, this product offers seamless data transfer at high speeds while ensuring compatibility and ease of use. Experience the value of superior performance and precision engineering with the TL16C550DIPTRG4, setting a new standard in serial communication technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good durability and protection to the internal components of the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly onto circuit boards, saving space and reducing overall production costs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V ensures compatibility with a wide range of systems and power sources.

Address Bus Width: 3

The address bus width of 3 allows for efficient communication and data transfer within the system.

Package Shape: SQUARE

The square package shape makes the product easy to handle and integrate into various system designs.

Power Supplies (V): 2.5/5

The availability of multiple power supply options (2.5V and 5V) gives flexibility in designing and implementing the product in different environments.

No. of Terminals: 48

The high number of terminals allows for multiple connections and interfaces, enabling complex communication protocols.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style makes the product suitable for compact and space-constrained applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures stable operation even under varying voltage conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to perform reliably in harsh environmental conditions.

Maximum Data Transfer Rate: 0.1875 MBps

The high maximum data transfer rate of 0.1875 MBps enables fast and efficient communication between devices.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can function in extreme cold environments without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures reliable connectivity and resistance to corrosion, improving the product's lifespan.

Terminal Position: QUAD

The quad terminal position allows for easy installation and secure connection within the system.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm helps in reducing the overall profile of the product, making it suitable for slim devices.

Width: 7 mm

The compact width of 7 mm enables the product to be mounted in tight spaces or on narrow circuit boards.

External Data Bus Width: 8

The external data bus width of 8 allows for high-speed data transfers and efficient communication between devices.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-level protocols ensures compatibility with a wide range of devices and systems.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency of 24 MHz enables quick processing and data handling, making the product ideal for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for proper soldering and bonding of the product during manufacturing.

Length: 7 mm

The compact length of 7 mm makes the product suitable for small and portable devices where space is a constraint.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate in rugged industrial environments without any performance degradation.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Being a serial IO/communication controller, this product can effectively manage and control serial communication interfaces for seamless data transfer.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making it a reliable choice.

Terminal Form: GULL WING

The gull wing terminal form provides easy soldering and secure attachment to the circuit board, ensuring reliable connections.

Maximum Supply Current: 8 mA

The low maximum supply current of 8 mA helps in reducing power consumption and heat generation, making the product energy-efficient.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures stable and consistent power supply to the product for reliable performance.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for dense packing and space-saving on the circuit board, making it suitable for compact designs.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product is relatively resistant to moisture absorption, ensuring long-term reliability in humid conditions.

Technical Specifications

Serial Communication Controllers TL16C550DIPTRG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 2.5V/3.3V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

24 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.1875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TL16C550DIPTRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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