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TL16C2550IRHBG4

Texas Instruments

TL16C2550IRHBG4 by Texas Instruments

TL16C2550IRHBG4 by Texas Instruments is a Serial Communication Controller with 32 terminals, operating at 24 MHz clock frequency. It supports data transfer rate of 0.1875 MBps and has a supply voltage range of 4.5V to 5.5V. Ideal for industrial applications requiring high-speed asynchronous communication protocols.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,399 parts In-Stock

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7,399

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Digiode

USA . 1,261 parts In-Stock

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1,261

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EMSNET

USA . 40 parts In-Stock

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40

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One Stop Electronics

USA . 613 parts In-Stock

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$6.000

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613

$6.000

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AZTECH Wire

Italy . 407 parts In-Stock

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$17.653

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407

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Parana Technologies

USA . 2,017 parts In-Stock

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$75.782

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DigiPath Technology Company

USA . 721 parts In-Stock

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$83.445

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$76.769

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721

$83.445

$76.769

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ChromeModa Solutions

Germany . 5,024 parts In-Stock

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$85.148

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$69.821

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$85.148

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IDEA Electronic Components Group

UK . 762 parts In-Stock

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$85.148

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$80.891

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$76.633

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762

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$76.633

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Microchip USA

USA . 4,776 parts In-Stock

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Corphita

USA . 1,336 parts In-Stock

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Overview

Enhance your communication systems with the Texas Instruments TL16C2550IRHBG4 Serial Communication Controller. With a reputation for excellence, Texas Instruments delivers top-notch quality and reliability in their products. Ideal for a wide range of applications, this controller offers seamless data transfer at high speeds, making it a valuable asset for any project. Upgrade your systems with the TL16C2550IRHBG4 and experience the difference in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the serial communication controller.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

A high maximum supply voltage of 5.5 V allows for flexibility in power supply options and compatibility with a wide range of systems.

Address Bus Width: 3

A wide address bus width of 3 enables efficient communication and data transfer between the serial communication controller and other components.

Package Shape: SQUARE

The square package shape is compact and facilitates easy placement and routing on a circuit board.

Power Supplies (V): 1.8/5

Multiple power supply options of 1.8V and 5V provide flexibility for different system requirements and voltages.

No. of Terminals: 32

Having 32 terminals allows for multiple connections and interfaces with other devices, enhancing the versatility of the serial communication controller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer customization options for different application needs, such as heat dissipation and space constraints.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures proper functionality and performance of the serial communication controller even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable operation in industrial environments with elevated temperatures.

Maximum Data Transfer Rate: 0.1875 MBps

The high data transfer rate of 0.1875 MBps facilitates fast and efficient communication between devices, reducing latency and improving overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the serial communication controller can function in a wide range of temperature conditions, including extreme cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The superior terminal finish of Nickel/Palladium/Gold provides excellent conductivity, corrosion resistance, and durability for reliable connections.

Terminal Position: QUAD

The Quad terminal position offers stability and secure connections, minimizing the risk of signal loss or interference during operation.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for a slim and compact design, ideal for applications with space constraints.

Width: 5 mm

A width of 5 mm ensures the serial communication controller can fit into tight spaces and compact hardware designs.

External Data Bus Width: 8

An external data bus width of 8 enables high-speed data transmission and efficient communication with external devices or peripherals.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol and bit-level data transfer offers flexibility and compatibility with various communication standards and systems.

Maximum Clock Frequency: 24 MHz

A high maximum clock frequency of 24 MHz ensures fast and synchronized data processing, suitable for demanding industrial applications.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the serial communication controller can withstand high-temperature reflow soldering processes during assembly.

Length: 5 mm

A length of 5 mm contributes to the compact and space-saving design of the serial communication controller, making it suitable for small form factor devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with wide temperature fluctuations and demanding conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Being a serial IO/communication controller, this product can efficiently handle serial data communication tasks and interface with various peripherals and devices.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and versatility for diverse digital applications, enhancing the efficiency and reliability of the serial communication controller.

Terminal Form: NO LEAD

The no-lead terminal form ensures environmental friendliness and compliance with regulations, making the product suitable for eco-conscious designs and applications.

Maximum Supply Current: 7.5 mA

A maximum supply current of 7.5 mA indicates low power consumption, making the serial communication controller energy-efficient and suitable for battery-powered or low-power devices.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V provides stable and reliable power delivery for optimal performance of the serial communication controller under normal operating conditions.

No. of Serial I/Os: 2

Having 2 serial I/Os allows for simultaneous communication with multiple devices or channels, increasing the flexibility and functionality of the serial communication controller.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5 mm enables high-density mounting and minimizes signal interference, suitable for compact and densely packed circuit board layouts.

Moisture Sensitivity Level (MSL): 2

A moisture sensitivity level of 2 indicates that the serial communication controller is moderately sensitive to moisture exposure during storage and handling, requiring standard precautions to prevent damage.

Technical Specifications

Serial Communication Controllers TL16C2550IRHBG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 10MHZ

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

24 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.1875 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

2

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

7.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

TL16C2550IRHBG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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