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TISP7290F3P

Texas Instruments

TISP7290F3P by Texas Instruments

TISP7290F3P by Texas Instruments is a 3-element surge protector with 5.7A peak current, 220V DC voltage, and 290V breakdown voltage. It is used for surge protection in various applications due to its UL recognition and thyristor trigger device type.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,570 parts In-Stock

1+ parts

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4,570

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Vyrian

USA . 2,745 parts In-Stock

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2,745

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Distributors (Availability)

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Parana Technologies

USA . 345 parts In-Stock

1+ parts

$3.026

100+ parts

-

1k+ parts

$3.536

10k+ parts

-

345

$3.026

-

$3.536

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DigiPath Technology Company

USA . 551 parts In-Stock

1+ parts

$3.332

100+ parts

$3.065

1k+ parts

-

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551

$3.332

$3.065

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ChromeModa Solutions

Germany . 6,473 parts In-Stock

1+ parts

$3.400

100+ parts

$2.788

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6,473

$3.400

$2.788

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IDEA Electronic Components Group

UK . 538 parts In-Stock

1+ parts

$3.400

100+ parts

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$3.060

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538

$3.400

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$3.060

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AZTECH Wire

Italy . 518 parts In-Stock

1+ parts

$12.426

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518

$12.426

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Ampacity Inc.

Singapore . 420 parts In-Stock

1+ parts

$16.100

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420

$16.100

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Semicontronic

India . 1,308 parts In-Stock

1+ parts

$18.100

100+ parts

$17.648

1k+ parts

$17.557

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1,308

$18.100

$17.648

$17.557

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One Stop Electronics

USA . 656 parts In-Stock

1+ parts

$27.100

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656

$27.100

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Corphita

USA . 1,846 parts In-Stock

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1,846

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Corohmni

South Africa . 69 parts In-Stock

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69

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Overview

Protect your valuable electronic devices with the TISP7290F3P by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality silicon surge protectors that offer reliable protection against voltage spikes and surges. Ideal for a variety of applications, this surge protector is designed with three elements in a delta connected configuration for maximum efficiency. With a non-repetitive peak on-state current of 5.7 A and a maximum breakdown voltage of 290 V, the TISP7290F3P provides peace of mind knowing your equipment is safeguarded. Trust Texas Instruments for superior surge protection solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the surge protector.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements provides effective distribution of surge protection across the connected devices for optimal performance.

Non Repetitive Peak On-state Current: 5.7 A

With a high non repetitive peak on-state current of 5.7 A, the surge protector can effectively handle sudden surges without being damaged.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and placement in various settings.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure connection and stability during operation.

Maximum DC Off-state Voltage: 220 V

The maximum DC off-state voltage of 220 V provides reliable protection against voltage spikes and ensures the safety of connected devices.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

Utilizing a thyristor surge protector as the trigger device type enhances the responsiveness and effectiveness of the surge protector in detecting and diverting surges.

Maximum Breakdown Voltage: 290 V

The maximum breakdown voltage of 290 V ensures that the surge protector can effectively handle higher voltage surges without compromising the connected devices.

Reference Standard: UL RECOGNIZED

Being UL recognized confirms that the surge protector has met safety and performance standards, providing peace of mind to users.

Technical Specifications

Silicon Surge Protectors TISP7290F3P attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

290 V

Maximum DC Off-state Voltage:

220 V

JESD-30 Code:

R-PDIP-T8

Non Repetitive Peak On-state Current:

5.7 A

No. of Elements:

3

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP7290F3P Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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