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TISP7082F3P

Texas Instruments

TISP7082F3P by Texas Instruments

TISP7082F3P by Texas Instruments is a 3-element surge protector with 4A peak current, 82V breakdown voltage, and UL recognition. It is a thyristor surge protector in a plastic/epoxy package for delta-connected configuration. Ideal for safeguarding against surges in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,512 parts In-Stock

1+ parts

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5,512

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Digiode

USA . 2,539 parts In-Stock

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2,539

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,543 parts In-Stock

1+ parts

$1.842

100+ parts

-

1k+ parts

$2.391

10k+ parts

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1,543

$1.842

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$2.391

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DigiPath Technology Company

USA . 1,992 parts In-Stock

1+ parts

$2.029

100+ parts

$1.866

1k+ parts

-

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1,992

$2.029

$1.866

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ChromeModa Solutions

Germany . 6,106 parts In-Stock

1+ parts

$2.070

100+ parts

$1.697

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6,106

$2.070

$1.697

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IDEA Electronic Components Group

UK . 1,781 parts In-Stock

1+ parts

$2.070

100+ parts

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$1.863

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1,781

$2.070

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$1.863

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Semicontronic

India . 880 parts In-Stock

1+ parts

$7.100

100+ parts

$6.922

1k+ parts

$6.887

10k+ parts

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880

$7.100

$6.922

$6.887

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One Stop Electronics

USA . 328 parts In-Stock

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$13.100

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328

$13.100

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AZTECH Wire

Italy . 385 parts In-Stock

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$16.895

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385

$16.895

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Ampacity Inc.

Singapore . 331 parts In-Stock

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$22.100

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331

$22.100

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Corphita

USA . 3,948 parts In-Stock

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3,948

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Corohmni

South Africa . 382 parts In-Stock

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382

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Overview

Experience peace of mind with the TISP7082F3P by Texas Instruments, a top-tier manufacturer known for producing high-quality silicon surge protectors. This device offers reliable protection against voltage spikes and surges, ensuring the safety of your valuable electronics. Whether you're safeguarding your home appliances or industrial equipment, this surge protector provides unparalleled performance and durability. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against external factors, ensuring a longer lifespan for the surge protector.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements allows for efficient protection and distribution of surge currents, making it suitable for handling high levels of electrical disturbances.

Non Repetitive Peak On-state Current: 4 A

With a high non-repetitive peak on-state current of 4A, this surge protector can effectively handle sudden surges in electrical currents without being damaged.

Maximum DC Off-state Voltage: 66 V

The maximum DC off-state voltage of 66V ensures that the surge protector can effectively block and protect against voltage spikes up to this level, making it suitable for a wide range of applications.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The use of thyristor surge protector as the trigger device ensures quick response and activation when a surge is detected, offering reliable protection for connected devices.

Technical Specifications

Silicon Surge Protectors TISP7082F3P attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

82 V

Maximum DC Off-state Voltage:

66 V

JESD-30 Code:

R-PDIP-T8

Non Repetitive Peak On-state Current:

4 A

No. of Elements:

3

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP7082F3P Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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