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TIES16C

Texas Instruments

TIES16C by Texas Instruments

TIES16C by Texas Instruments is an Infrared LED with 3A max forward current, emitting at 930nm peak wavelength. Ideal for applications requiring a wide viewing angle of 150° and spectral bandwidth of 45m. Operates b/w -55°C to 100°C, making it suitable for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,742 parts In-Stock

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Digiode

USA . 1,065 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,576 parts In-Stock

1+ parts

$0.587

100+ parts

$54.466

1k+ parts

$0.528

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1,576

$0.587

$54.466

$0.528

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DigiPath Technology Company

USA . 2,236 parts In-Stock

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$0.646

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$0.594

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2,236

$0.646

$0.594

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ChromeModa Solutions

Germany . 1,763 parts In-Stock

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$0.659

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$0.540

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$0.659

$0.540

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IDEA Electronic Components Group

UK . 766 parts In-Stock

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$0.659

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$0.593

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766

$0.659

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$0.593

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Ampacity Inc.

Singapore . 914 parts In-Stock

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$9.100

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914

$9.100

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AZTECH Wire

Italy . 292 parts In-Stock

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$9.511

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292

$9.511

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One Stop Electronics

USA . 773 parts In-Stock

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$12.100

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Semicontronic

India . 1,246 parts In-Stock

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$17.100

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$16.672

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$16.587

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1,246

$17.100

$16.672

$16.587

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Corphita

USA . 581 parts In-Stock

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Corohmni

South Africa . 284 parts In-Stock

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Overview

Illuminate your world with the TIES16C by Texas Instruments, a high-quality Infrared LED that delivers superior performance and reliability. Perfect for a wide range of applications, from remote controls to security systems, this product offers unmatched value with its peak wavelength of 930nm and maximum forward current of 3A. With Texas Instruments' reputation for excellence in manufacturing, you can trust that the TIES16C will exceed your expectations and provide the advantages you need for your projects. Upgrade your technology with the TIES16C today and experience the benefits of cutting-edge innovation.

Feature Benefit Bullets

Maximum Forward Current: 3 A

High maximum forward current allows for efficient operation and longer lifespan of the Infrared LEDs.

Peak Wavelength (nm): 930

The peak wavelength of 930 nm is ideal for various applications including optical sensors, night vision systems, and communication devices.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, this product can withstand harsh environmental conditions and high-temperature applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures reliable performance even in extreme cold environments.

Maximum Reverse Voltage: 2 V

The maximum reverse voltage of 2V protects the LEDs from potential damage in case of reversed polarity.

Semiconductor Material: GaAs

Gallium Arsenide (GaAs) semiconductor material offers high efficiency and reliability, making these LEDs suitable for critical applications.

Viewing Angle: 150°

Wide viewing angle of 150° allows for better coverage and visibility in the application area.

Spectral Bandwidth: 45 m

Narrow spectral bandwidth of 45 nm ensures precise and accurate emission of infrared light for specific detection and sensing requirements.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature provides secure and stable installation of the LEDs onto a circuit board or mounting surface.

Maximum Forward Voltage: 2.2 V

Low maximum forward voltage of 2.2V ensures efficient power consumption and optimal performance of the Infrared LEDs.

Technical Specifications

Infrared LEDs TIES16C attributes and parameters. Explore more Infrared LEDs devices from Texas Instruments

Specs

Maximum Forward Current:

3 A

Maximum Forward Voltage:

2.2 V

Mounting Feature:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Peak Wavelength (nm):

930

Maximum Reverse Voltage:

2 V

Semiconductor Material:

GaAs

Spectral Bandwidth:

45 m

Sub-Category:

Infrared LEDs

Viewing Angle:

150 deg

Trade Compliance

TIES16C Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.20.00

SB

8541.40.20.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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