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THS8083-95CPZP

Texas Instruments

THS8083-95CPZP by Texas Instruments

THS8083-95CPZP by Texas Instruments is a 100-terminal consumer IC with 3.3V power supply, suitable for commercial applications. It features a flatpack package style, CMOS technology, and operates b/w 0 to 70°C. Ideal for surface mount assembly with a terminal pitch of 0.5mm and Gull Wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,713 parts In-Stock

1+ parts

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4,713

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Vyrian

USA . 3,935 parts In-Stock

1+ parts

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3,935

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 705 parts In-Stock

1+ parts

$3.558

100+ parts

-

1k+ parts

$4.081

10k+ parts

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705

$3.558

-

$4.081

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DigiPath Technology Company

USA . 662 parts In-Stock

1+ parts

$3.918

100+ parts

$3.605

1k+ parts

-

10k+ parts

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662

$3.918

$3.605

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IDEA Electronic Components Group

UK . 1,705 parts In-Stock

1+ parts

$3.998

100+ parts

-

1k+ parts

$3.598

10k+ parts

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1,705

$3.998

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$3.598

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ChromeModa Solutions

Germany . 457 parts In-Stock

1+ parts

$3.998

100+ parts

$3.278

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457

$3.998

$3.278

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One Stop Electronics

USA . 1,221 parts In-Stock

1+ parts

$9.800

100+ parts

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1,221

$9.800

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AZTECH Wire

Italy . 447 parts In-Stock

1+ parts

$17.224

100+ parts

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447

$17.224

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Corphita

USA . 3,279 parts In-Stock

1+ parts

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3,279

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Overview

Unlock the power of cutting-edge technology with the THS8083-95CPZP by Texas Instruments. Designed with precision and expertise, this consumer IC offers unparalleled performance and reliability. Perfect for a wide range of applications, this product delivers exceptional value and benefits to customers. Experience the advantage of seamless integration, innovative design, and superior quality with the THS8083-95CPZP. Elevate your projects to new heights with this top-of-the-line solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in consumer electronic products due to its affordability and durability.

Surface Mount: YES

Surface mount components are easier to mass-produce and can contribute to smaller and more lightweight devices.

Package Shape: SQUARE

Square packages can be more space-efficient and easier to handle during assembly.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics, ensuring optimal performance in such applications.

Power Supplies (V): 3.3

Operating at a common voltage level makes integration with other components easier and more straightforward.

No. of Terminals: 100

Having a higher number of terminals allows for more connectivity options and functionalities in the circuit design.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style offers a combination of thermal management, compact design, and high-density interconnectivity for improved performance.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can withstand a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

Operating at low temperatures ensures reliable performance even in colder environments.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of signals and power connections within the circuit.

Maximum Seated Height: 1.2 mm

A low seated height can be beneficial for applications where space constraints are a concern.

Width: 14 mm

The compact width of the IC makes it suitable for use in small electronic devices.

Minimum Supply Voltage (Vsup): 3.15 V

Having a low minimum supply voltage ensures compatibility with a wide range of power sources.

Length: 14 mm

The overall small footprint of the IC contributes to space-saving design in electronic products.

Temperature Grade: COMMERCIAL

Designed for commercial applications, ensuring reliability and performance in typical consumer electronics.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for consumer electronic devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder joints and ease of assembly during manufacturing.

Maximum Supply Current: 340 mA

Capable of handling higher supply currents, making it suitable for power-hungry consumer electronics.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density packaging and smaller footprint on the PCB.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this IC can handle a wide range of input power levels.

Technical Specifications

Other Function Consumer ICs THS8083-95CPZP attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

340 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

THS8083-95CPZP General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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