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THS8200IPFPEP

Texas Instruments

THS8200IPFPEP by Texas Instruments

THS8200IPFPEP by Texas Instruments is an 80-terminal consumer IC with a package style of flatpack, heat sink/slug. It operates b/w -40 to 85°C and has a terminal pitch of 0.5mm. Ideal for industrial applications requiring a min supply voltage of 3V.

Median Price

$26.887

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 113,156 parts In-Stock

1+ parts

$17.354

100+ parts

$15.708

1k+ parts

$14.960

10k+ parts

-

113,156

$17.354

$15.708

$14.960

-

Mouser Electronics

USA . 44 parts In-Stock

1+ parts

$35.540

100+ parts

$24.780

1k+ parts

-

10k+ parts

-

44

$35.540

$24.780

-

-

Rochester

USA . 126 parts In-Stock

1+ parts

-

100+ parts

$21.510

1k+ parts

$19.240

10k+ parts

$18.110

126

-

$21.510

$19.240

$18.110

DigiKey

USA . 126 parts In-Stock

1+ parts

-

100+ parts

$28.300

1k+ parts

-

10k+ parts

-

126

-

$28.300

-

-

Verical

USA . 71 parts In-Stock

1+ parts

-

100+ parts

$26.887

1k+ parts

$24.050

10k+ parts

$22.637

71

-

$26.887

$24.050

$22.637

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,371 parts In-Stock

1+ parts

$16.486

100+ parts

-

1k+ parts

-

10k+ parts

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4,371

$16.486

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$20.060

100+ parts

-

1k+ parts

-

10k+ parts

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100

$20.060

-

-

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Vyrian

USA . 6,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,187

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-

-

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Chip Stock

USA . 3,461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,461

-

-

-

-

DigiKey Marketplace

USA . 126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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126

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-

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North Shore Components

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,148 parts In-Stock

1+ parts

$2.617

100+ parts

$243.074

1k+ parts

$2.356

10k+ parts

-

1,148

$2.617

$243.074

$2.356

-

DigiPath Technology Company

USA . 1,738 parts In-Stock

1+ parts

$2.882

100+ parts

$2.652

1k+ parts

-

10k+ parts

-

1,738

$2.882

$2.652

-

-

ChromeModa Solutions

Germany . 3,378 parts In-Stock

1+ parts

$2.941

100+ parts

$2.412

1k+ parts

-

10k+ parts

-

3,378

$2.941

$2.412

-

-

IDEA Electronic Components Group

UK . 1,313 parts In-Stock

1+ parts

$2.941

100+ parts

-

1k+ parts

$2.647

10k+ parts

-

1,313

$2.941

-

$2.647

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Ampacity Inc.

Singapore . 22,247 parts In-Stock

1+ parts

$14.750

100+ parts

-

1k+ parts

-

10k+ parts

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22,247

$14.750

-

-

-

Corphita

USA . 2,145 parts In-Stock

1+ parts

$15.619

100+ parts

-

1k+ parts

-

10k+ parts

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2,145

$15.619

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$20.060

100+ parts

-

1k+ parts

-

10k+ parts

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100

$20.060

-

-

-

Microchip USA

USA . 2,168 parts In-Stock

1+ parts

$53.869

100+ parts

-

1k+ parts

-

10k+ parts

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2,168

$53.869

-

-

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S.R.D Solutions

India . 30,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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30,000

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-

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Kepictronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

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9,000

-

-

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A-Z Elektronik GmbH

Germany . 5,525 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,525

-

-

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iodParts Technologies Inc.

India . 4,231 parts In-Stock

1+ parts

-

100+ parts

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4,231

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-

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Perfect Parts

USA . 127 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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127

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-

Overview

Elevate your consumer electronics with the THS8200IPFPEP by Texas Instruments, a top-of-the-line IC that delivers unparalleled quality and performance. Crafted by a renowned manufacturer, this consumer circuit offers reliable functionality in a compact package while operating efficiently in industrial settings. With its advanced features and durable construction, this IC is perfect for a wide range of applications, providing customers with exceptional value and benefits. Upgrade your devices today with the THS8200IPFPEP and experience innovation like never before.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount:

YES - This feature allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape:

SQUARE - The compact square shape saves space and allows for efficient placement on circuit boards.

General IC Type:

CONSUMER CIRCUIT - Designed specifically for consumer electronics, ensuring compatibility and reliable performance.

No. of Terminals:

80 - With a high number of terminals, this IC can support complex functions and connections.

Package Style:

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH - The various package styles offer flexibility in design and application, catering to different requirements.

Maximum Operating Temperature:

85 °C - With a high maximum operating temperature, the IC can withstand harsh environments and extended use.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature ensures the IC remains functional in extreme cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position:

QUAD - The quad terminal position allows for efficient routing of connections, optimizing circuit performance.

Maximum Seated Height:

1.2 mm - The low seated height enables compact designs and minimizes interference with other components.

Width:

12 mm - The slim width makes the IC suitable for tight spaces and compact electronics.

Minimum Supply Voltage (Vsup):

3 V - This low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s):

30 - The short reflow time reduces the risk of damage to the IC during assembly, ensuring reliability.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature enables efficient soldering, ensuring secure connections.

Length:

12 mm - The compact length saves space on the circuit board and allows for versatile placement.

Temperature Grade:

INDUSTRIAL - Designed for industrial applications, this IC can withstand demanding conditions and high temperatures.

Terminal Form:

GULL WING - The gull wing terminal form provides strong mechanical support and easy handling during installation.

Terminal Pitch:

0.5 mm - The fine terminal pitch allows for precise connections and compact layouts, perfect for intricate circuit designs.

Moisture Sensitivity Level (MSL):

3 - This MSL rating indicates the level of protection against moisture, ensuring long-term reliability in various environments.

Maximum Supply Voltage (Vsup):

3.6 V - With a high maximum supply voltage, this IC can handle a wide range of power requirements, offering flexibility in design.

Technical Specifications

Other Function Consumer ICs THS8200IPFPEP attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 1.8V DIGITAL SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

THS8200IPFPEP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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