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THS8210PFP

Texas Instruments

THS8210PFP by Texas Instruments

THS8210PFP by Texas Instruments is a consumer IC with 80 terminals in a square package. It operates b/w 0-70°C, with supply voltage ranging from 3-3.6V. Ideal for applications requiring fine pitch and thin profile designs in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,542 parts In-Stock

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5,542

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Digiode

USA . 3,188 parts In-Stock

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3,188

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,416 parts In-Stock

1+ parts

$2.211

100+ parts

-

1k+ parts

$2.719

10k+ parts

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1,416

$2.211

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$2.719

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DigiPath Technology Company

USA . 388 parts In-Stock

1+ parts

$2.434

100+ parts

$2.240

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388

$2.434

$2.240

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ChromeModa Solutions

Germany . 3,889 parts In-Stock

1+ parts

$2.484

100+ parts

$2.037

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3,889

$2.484

$2.037

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IDEA Electronic Components Group

UK . 404 parts In-Stock

1+ parts

$2.484

100+ parts

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$2.236

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404

$2.484

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$2.236

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One Stop Electronics

USA . 1,090 parts In-Stock

1+ parts

$11.800

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1,090

$11.800

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AZTECH Wire

Italy . 733 parts In-Stock

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$19.571

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733

$19.571

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Corphita

USA . 3,927 parts In-Stock

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3,927

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Overview

Upgrade your consumer electronics with the cutting-edge THS8210PFP by Texas Instruments. Crafted with precision and expertise, this high-quality IC offers unparalleled performance and reliability. Ideal for a wide range of applications in the consumer electronics industry, this product delivers exceptional value and benefits to customers looking for top-notch solutions. Trust Texas Instruments to provide you with the best in class technology that will take your products to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for consumer electronics.

Surface Mount: YES

Easier and more efficient assembly onto circuit boards.

Package Shape: SQUARE

Compact design for space-saving applications.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronic applications, ensuring compatibility and functionality.

No. of Terminals: 80

Sufficient number of terminals for versatile connectivity options.

Maximum Operating Temperature: 70 °C

Supports reliable operation within a wide range of temperatures.

Minimum Operating Temperature: 0 °C

Can withstand low temperatures, suitable for various environments.

Terminal Position: QUAD

Quad terminal position for enhanced stability and secure connections.

Width: 12 mm

Compact width for easy integration in space-constrained devices.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement for energy-efficient operation.

Length: 12 mm

Uniform dimensions for a symmetrical layout and easy installation.

Temperature Grade: COMMERCIAL

Meets industry standards for commercial-grade performance and durability.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and connection stability.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections and compact circuit design.

Maximum Supply Voltage (Vsup): 3.6 V

Safe maximum supply voltage limit for reliable and stable operation.

Technical Specifications

Other Function Consumer ICs THS8210PFP attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 1.8V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

THS8210PFP General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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