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THS8083APZP

Texas Instruments

THS8083APZP by Texas Instruments

THS8083APZP by Texas Instruments is a 100-terminal consumer IC with 3.3V power supply, operating b/w 0-70°C. It features CMOS technology, GULL WING terminals, and supports up to 500mA current. Ideal for applications requiring a compact flatpack design with thin profile and fine pitch.

Median Price

$26.920

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 2 parts In-Stock

1+ parts

$26.920

100+ parts

$20.190

1k+ parts

$17.500

10k+ parts

-

2

$26.920

$20.190

$17.500

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Digiode

USA . 2,459 parts In-Stock

1+ parts

-

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-

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2,459

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Vyrian

USA . 2,190 parts In-Stock

1+ parts

-

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2,190

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

-

100+ parts

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600

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,780 parts In-Stock

1+ parts

$2.875

100+ parts

-

1k+ parts

$3.366

10k+ parts

-

1,780

$2.875

-

$3.366

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ChromeModa Solutions

Germany . 2,445 parts In-Stock

1+ parts

$3.230

100+ parts

$2.649

1k+ parts

-

10k+ parts

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2,445

$3.230

$2.649

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IDEA Electronic Components Group

UK . 297 parts In-Stock

1+ parts

$3.230

100+ parts

-

1k+ parts

$2.907

10k+ parts

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297

$3.230

-

$2.907

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Ampacity Inc.

Singapore . 755 parts In-Stock

1+ parts

$5.800

100+ parts

-

1k+ parts

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755

$5.800

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AZTECH Wire

Italy . 843 parts In-Stock

1+ parts

$17.272

100+ parts

-

1k+ parts

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10k+ parts

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843

$17.272

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One Stop Electronics

USA . 648 parts In-Stock

1+ parts

$18.800

100+ parts

-

1k+ parts

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648

$18.800

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Lixinc

USA . 14,118 parts In-Stock

1+ parts

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14,118

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A-Z Elektronik GmbH

Germany . 6,663 parts In-Stock

1+ parts

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6,663

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Corphita

USA . 4,754 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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4,754

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DigiPath Technology Company

USA . 2,334 parts In-Stock

1+ parts

-

100+ parts

$2.912

1k+ parts

-

10k+ parts

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2,334

-

$2.912

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,000

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Microchip USA

USA . 420 parts In-Stock

1+ parts

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420

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Kepictronics

USA . 225 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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225

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Overview

Elevate your consumer electronics with the THS8083APZP by Texas Instruments. With a commitment to quality and innovation, Texas Instruments delivers superior ICs for various applications. This versatile product offers customers reliable performance, efficiency, and value. Whether you're designing cutting-edge audio equipment or creating advanced control systems, the THS8083APZP is the perfect choice. Trust Texas Instruments for all your IC needs and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring long-lasting performance and easy handling.

Surface Mount: YES

Easy to mount on circuit boards, simplifying the assembly process.

Power Supplies (V): 3.3

Compatible with commonly used power supplies, making it versatile for different applications.

No. of Terminals: 100

Sufficient terminals for connectivity, allowing for a wide range of functions and connections.

Maximum Operating Temperature: 70 °C

Can operate effectively in most environmental conditions without overheating.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and reliable performance.

Technical Specifications

Other Function Consumer ICs THS8083APZP attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

500 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

THS8083APZP General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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