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TDP1204RNQT

Texas Instruments

TDP1204RNQT by Texas Instruments

TDP1204RNQT by Texas Instruments is a 40-terminal interface IC with a supply voltage range of 3-3.6V, operating temperature of 0-85°C, and terminal finish in nickel palladium gold. It is used for various applications requiring a quad-terminal form factor, such as communication systems and industrial automation equipment.

Median Price

$7.680

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,640 parts In-Stock

1+ parts

$5.610

100+ parts

$4.574

1k+ parts

$3.049

10k+ parts

-

4,640

$5.610

$4.574

$3.049

-

Mouser Electronics

USA . 262 parts In-Stock

1+ parts

$9.750

100+ parts

$6.310

1k+ parts

$4.740

10k+ parts

-

262

$9.750

$6.310

$4.740

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,685 parts In-Stock

1+ parts

$5.330

100+ parts

-

1k+ parts

-

10k+ parts

-

2,685

$5.330

-

-

-

Vyrian

USA . 2,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,985

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,277 parts In-Stock

1+ parts

$4.770

100+ parts

-

1k+ parts

-

10k+ parts

-

2,277

$4.770

-

-

-

Semicontronic

India . 2,118 parts In-Stock

1+ parts

$4.770

100+ parts

$4.651

1k+ parts

$4.627

10k+ parts

-

2,118

$4.770

$4.651

$4.627

-

Corphita

USA . 458 parts In-Stock

1+ parts

$5.049

100+ parts

-

1k+ parts

-

10k+ parts

-

458

$5.049

-

-

-

Corohmni

South Africa . 115 parts In-Stock

1+ parts

$5.610

100+ parts

-

1k+ parts

-

10k+ parts

-

115

$5.610

-

-

-

Parana Technologies

USA . 1,970 parts In-Stock

1+ parts

$6.176

100+ parts

-

1k+ parts

$6.943

10k+ parts

-

1,970

$6.176

-

$6.943

-

DigiPath Technology Company

USA . 2,021 parts In-Stock

1+ parts

$6.800

100+ parts

-

1k+ parts

-

10k+ parts

-

2,021

$6.800

-

-

-

IDEA Electronic Components Group

UK . 2,121 parts In-Stock

1+ parts

$6.939

100+ parts

-

1k+ parts

$6.245

10k+ parts

-

2,121

$6.939

-

$6.245

-

ChromeModa Solutions

Germany . 1,497 parts In-Stock

1+ parts

$6.939

100+ parts

$5.690

1k+ parts

-

10k+ parts

-

1,497

$6.939

$5.690

-

-

Microchip USA

USA . 2,649 parts In-Stock

1+ parts

$14.660

100+ parts

$14.450

1k+ parts

$14.340

10k+ parts

$14.240

2,649

$14.660

$14.450

$14.340

$14.240

Overview

Elevate your electronics projects with the TDP1204RNQT by Texas Instruments. With a reputation for excellence, Texas Instruments delivers top-notch quality in the category of Other Function Interface ICs. This versatile product offers customers exceptional value and benefits, making it a must-have for any application requiring interface circuitry. Trust Texas Instruments to provide cutting-edge technology and reliability in every component, ensuring your projects perform at their best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external factors, ensuring the longevity of the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product can handle higher voltage inputs without risk of damage, providing flexibility in application.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the PCB, maximizing component density and reducing overall system size.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options, making this product suitable for complex interface requirements.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This combination of package styles ensures effective heat dissipation, compact form factor, and easy integration into various design layouts.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V allows for operation in low-power scenarios, making it energy-efficient and versatile.

Maximum Operating Temperature: 85 °C

Capable of operating at temperatures up to 85°C, this product is suitable for industrial and harsh environment applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this product is reliable even in cold environments, ensuring consistent performance under varying conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity, corrosion resistance, and solderability, enhancing the overall reliability and durability of the product.

Terminal Position: QUAD

Quad terminal position enables efficient signal routing and connection, ensuring stable and secure electrical connections.

Maximum Seated Height: 0.8 mm

With a maximum seated height of 0.8mm, this product allows for low-profile designs, reducing overall system height and enabling space-saving solutions.

Width: 4 mm

Having a width of 4mm facilitates compact PCB layout and efficient space utilization, ideal for applications with size constraints.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of 260°C, this product ensures reliable solder joints and withstands manufacturing processes without degradation.

Length: 6 mm

A length of 6mm offers a balanced form factor, fitting well within standard PCB dimensions and providing ease of integration into various designs.

No. of Channels: 4

With 4 channels, this product can handle multiple signal pathways simultaneously, making it suitable for applications requiring parallel data processing or communication.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination, making this product environmentally friendly and compliant with regulations.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard voltage levels, making it a versatile choice for various electronic systems.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4mm allows for precise signal routing and high-density mounting, ideal for applications with tight space constraints.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, this product facilitates communication between different components or systems, making it essential for seamless data exchange and integration.

Technical Specifications

Other Function Interface ICs TDP1204RNQT attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.16X.24,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TDP1204RNQT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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