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TDP1204IRNQT

Texas Instruments

TDP1204IRNQT by Texas Instruments

TDP1204IRNQT by Texas Instruments is a 40-terminal interface IC with a supply voltage range of 3-3.6V, operating temperature from -40 to 85°C, and terminal finish in nickel palladium gold. It is designed for applications requiring a quad-channel interface circuit in a compact chip carrier package suitable for surface mount assembly.

Median Price

$9.040

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,681 parts In-Stock

1+ parts

$6.311

100+ parts

$5.145

1k+ parts

$3.430

10k+ parts

-

9,681

$6.311

$5.145

$3.430

-

Mouser Electronics

USA . 292 parts In-Stock

1+ parts

$9.040

100+ parts

$5.980

1k+ parts

$5.330

10k+ parts

-

292

$9.040

$5.980

$5.330

-

DigiKey

USA . 259 parts In-Stock

1+ parts

$9.040

100+ parts

$5.973

1k+ parts

$5.471

10k+ parts

$5.332

259

$9.040

$5.973

$5.471

$5.332

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 796 parts In-Stock

1+ parts

$5.995

100+ parts

-

1k+ parts

-

10k+ parts

-

796

$5.995

-

-

-

Vyrian

USA . 4,299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,299

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,195 parts In-Stock

1+ parts

$5.360

100+ parts

-

1k+ parts

-

10k+ parts

-

3,195

$5.360

-

-

-

Semicontronic

India . 3,079 parts In-Stock

1+ parts

$5.360

100+ parts

$5.226

1k+ parts

$5.199

10k+ parts

-

3,079

$5.360

$5.226

$5.199

-

Corphita

USA . 3,287 parts In-Stock

1+ parts

$5.680

100+ parts

-

1k+ parts

-

10k+ parts

-

3,287

$5.680

-

-

-

Corohmni

South Africa . 403 parts In-Stock

1+ parts

$6.311

100+ parts

-

1k+ parts

-

10k+ parts

-

403

$6.311

-

-

-

Component Stockers USA

USA . 930 parts In-Stock

1+ parts

$8.100

100+ parts

$6.060

1k+ parts

-

10k+ parts

-

930

$8.100

$6.060

-

-

Parana Technologies

USA . 1,556 parts In-Stock

1+ parts

$11.934

100+ parts

-

1k+ parts

$12.339

10k+ parts

-

1,556

$11.934

-

$12.339

-

DigiPath Technology Company

USA . 992 parts In-Stock

1+ parts

$13.141

100+ parts

-

1k+ parts

-

10k+ parts

-

992

$13.141

-

-

-

ChromeModa Solutions

Germany . 3,115 parts In-Stock

1+ parts

$13.409

100+ parts

$10.995

1k+ parts

-

10k+ parts

-

3,115

$13.409

$10.995

-

-

IDEA Electronic Components Group

UK . 2,213 parts In-Stock

1+ parts

$13.409

100+ parts

$12.739

1k+ parts

$12.068

10k+ parts

-

2,213

$13.409

$12.739

$12.068

-

Microchip USA

USA . 2,506 parts In-Stock

1+ parts

$16.490

100+ parts

$16.250

1k+ parts

$16.140

10k+ parts

$16.020

2,506

$16.490

$16.250

$16.140

$16.020

QUARKTWIN TECHNOLOGY LTD

USA . 28,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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28,115

-

-

-

-

Overview

Experience superior quality and reliability with the TDP1204IRNQT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge solutions for various applications in the category of Other Function Interface ICs. This product offers unmatched value, benefits, and advantages to customers seeking a high-performance interface circuit. Trust Texas Instruments for innovative technology that ensures optimal performance and efficiency in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle high supply voltage levels, providing flexibility in different electronic applications.

Package Shape: RECTANGULAR

Rectangular shape enables efficient PCB layout and space utilization.

No. of Terminals: 40

High number of terminals allows for more connectivity options and functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances thermal performance and saves space in the overall system.

Minimum Operating Temperature: -40 °C

Can operate in extremely low-temperature environments, making it suitable for a wide range of applications.

Nominal Supply Voltage: 3.3 V

Stable and standard supply voltage ensures reliable operation in various circuit designs.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, ensuring seamless communication between different components in a system.

Technical Specifications

Other Function Interface ICs TDP1204IRNQT attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.16X.24,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TDP1204IRNQT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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