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TDP1204IRNQR

Texas Instruments

TDP1204IRNQR by Texas Instruments

TDP1204IRNQR by Texas Instruments is a 40-terminal interface IC with max supply voltage of 3.6V, suitable for applications requiring quad-channel interface circuits. With a package style of chip carrier and very thin profile, it operates b/w -40°C to 85°C, making it ideal for various electronic devices.

Median Price

$7.383

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,687 parts In-Stock

1+ parts

$5.376

100+ parts

$4.383

1k+ parts

$2.922

10k+ parts

-

7,687

$5.376

$4.383

$2.922

-

Mouser Electronics

USA . 1,404 parts In-Stock

1+ parts

$9.390

100+ parts

$6.040

1k+ parts

-

10k+ parts

-

1,404

$9.390

$6.040

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.176

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$3.176

-

-

-

Digiode

USA . 2,709 parts In-Stock

1+ parts

$5.107

100+ parts

-

1k+ parts

-

10k+ parts

-

2,709

$5.107

-

-

-

Chip Stock

USA . 5,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,355

-

-

-

-

Vyrian

USA . 4,851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,851

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

$3.176

100+ parts

$3.017

1k+ parts

$2.866

10k+ parts

$2.827

120

$3.176

$3.017

$2.866

$2.827

Argo Parts USA

USA . 3,108 parts In-Stock

1+ parts

$3.176

100+ parts

-

1k+ parts

-

10k+ parts

-

3,108

$3.176

-

-

-

Continental Prestige Electronics

USA . 620 parts In-Stock

1+ parts

$3.176

100+ parts

-

1k+ parts

-

10k+ parts

$3.113

620

$3.176

-

-

$3.113

Ampacity Inc.

Singapore . 5,164 parts In-Stock

1+ parts

$4.570

100+ parts

-

1k+ parts

-

10k+ parts

-

5,164

$4.570

-

-

-

Corphita

USA . 4,135 parts In-Stock

1+ parts

$4.838

100+ parts

-

1k+ parts

-

10k+ parts

-

4,135

$4.838

-

-

-

Parana Technologies

USA . 643 parts In-Stock

1+ parts

$12.318

100+ parts

$1,143.959

1k+ parts

$11.087

10k+ parts

-

643

$12.318

$1,143.959

$11.087

-

DigiPath Technology Company

USA . 97 parts In-Stock

1+ parts

$13.564

100+ parts

-

1k+ parts

-

10k+ parts

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97

$13.564

-

-

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ChromeModa Solutions

Germany . 2,576 parts In-Stock

1+ parts

$13.841

100+ parts

$11.350

1k+ parts

-

10k+ parts

-

2,576

$13.841

$11.350

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-

IDEA Electronic Components Group

UK . 1,975 parts In-Stock

1+ parts

$13.841

100+ parts

$13.149

1k+ parts

$12.457

10k+ parts

-

1,975

$13.841

$13.149

$12.457

-

iodParts Technologies Inc.

India . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

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-

Overview

Elevate your electronic designs with the TDP1204IRNQR by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers innovative solutions in the category of Other Function Interface ICs. This versatile chip carrier offers endless possibilities for your projects, with a very thin profile and quad terminal position for seamless integration. With a nominal supply voltage of 3.3V and a maximum operating temperature of 85°C, this interface circuit ensures optimal performance in a wide range of applications. Experience the value and benefits of Texas Instruments' cutting-edge technology with the TDP1204IRNQR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good thermal and electrical insulation, making the product durable and reliable.

Surface Mount: YES

Surface mount option allows for easy and space-efficient installation on PCBs, improving overall product design.

Maximum Supply Voltage: 3.6 V

Ability to handle higher supply voltage levels ensures reliable performance in various applications.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts and facilitates easy integration into existing designs.

No. of Terminals: 40

Higher number of terminals allows for more connectivity options, increasing versatility of the product.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Chip carrier style with heat sink/slug design and thin profile enhances thermal performance and enables compact circuit layouts.

Minimum Supply Voltage: 3 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable operation in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature capability ensures product functionality in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent corrosion resistance and reliable contact performance.

Terminal Position: QUAD

Quad terminal position offers improved stability and connectivity, enhancing overall performance and reliability.

Maximum Seated Height: 0.8 mm

Low maximum seated height allows for slim and compact product designs, saving space in electronic devices.

Width: 4 mm

Narrow width dimension enables the product to fit into tight spaces on PCBs and in electronic assemblies.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robust soldering and assembly processes during production.

Length: 6 mm

Optimal length dimension provides a balance between space efficiency and connectivity options for the product.

No. of Channels: 4

Multiple channels offer enhanced functionality and connectivity options, expanding the utility of the product.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes sustainability in electronic manufacturing.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 0.4 mm

Small terminal pitch allows for high-density PCB layouts and efficient use of available space for circuit connections.

Interface IC Type: INTERFACE CIRCUIT

Specific interface circuit type indicates the product's dedicated function and compatibility with various communication protocols.

Technical Specifications

Other Function Interface ICs TDP1204IRNQR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.16X.24,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TDP1204IRNQR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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