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TDP158RSBR

Texas Instruments

TDP158RSBR by Texas Instruments

TDP158RSBR by Texas Instruments is a 40-terminal interface IC with a package style of chip carrier. It operates b/w 0-85°C, with a supply voltage range of 1-1.27V. Ideal for applications requiring a compact, surface-mount solution with 4 channels and high reflow temperature tolerance.

Median Price

$4.780

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 24,117 parts In-Stock

1+ parts

$3.422

100+ parts

$2.998

1k+ parts

$1.694

10k+ parts

-

24,117

$3.422

$2.998

$1.694

-

DigiKey

USA . 4,577 parts In-Stock

1+ parts

$4.780

100+ parts

$3.037

1k+ parts

$2.722

10k+ parts

$2.630

4,577

$4.780

$3.037

$2.722

$2.630

Mouser Electronics

USA . 3,334 parts In-Stock

1+ parts

$4.780

100+ parts

$3.040

1k+ parts

$2.730

10k+ parts

$2.630

3,334

$4.780

$3.040

$2.730

$2.630

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,758 parts In-Stock

1+ parts

$3.251

100+ parts

-

1k+ parts

-

10k+ parts

-

3,758

$3.251

-

-

-

Vyrian

USA . 2,633 parts In-Stock

1+ parts

$3.422

100+ parts

-

1k+ parts

-

10k+ parts

-

2,633

$3.422

-

-

-

Chip Stock

USA . 20,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20,640

-

-

-

-

Cyclops Electronics Ltd

UK . 2,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,800

-

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,761 parts In-Stock

1+ parts

$2.910

100+ parts

-

1k+ parts

-

10k+ parts

-

10,761

$2.910

-

-

-

Corphita

USA . 3,309 parts In-Stock

1+ parts

$3.080

100+ parts

-

1k+ parts

-

10k+ parts

-

3,309

$3.080

-

-

-

Parana Technologies

USA . 1,902 parts In-Stock

1+ parts

$6.575

100+ parts

-

1k+ parts

$7.315

10k+ parts

-

1,902

$6.575

-

$7.315

-

DigiPath Technology Company

USA . 1,796 parts In-Stock

1+ parts

$7.240

100+ parts

-

1k+ parts

-

10k+ parts

-

1,796

$7.240

-

-

-

ChromeModa Solutions

Germany . 394 parts In-Stock

1+ parts

$7.388

100+ parts

$6.058

1k+ parts

-

10k+ parts

-

394

$7.388

$6.058

-

-

IDEA Electronic Components Group

UK . 326 parts In-Stock

1+ parts

$7.388

100+ parts

-

1k+ parts

$6.649

10k+ parts

-

326

$7.388

-

$6.649

-

Advanced Electronics

New Zealand . 804 parts In-Stock

1+ parts

$9.223

100+ parts

$9.131

1k+ parts

$8.762

10k+ parts

-

804

$9.223

$9.131

$8.762

-

Lixinc

USA . 14,845 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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14,845

-

-

-

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Technoshack Inc. (Excess)

Canada . 8,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,000

-

-

-

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A-Z Elektronik GmbH

Germany . 3,956 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,956

-

-

-

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Infinite Electronics LLP (Excess)

. 1,716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,716

-

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100

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-

Overview

Unlock unparalleled performance and reliability with the TDP158RSBR by Texas Instruments. With a commitment to excellence, Texas Instruments delivers top-quality interface ICs like no other. This versatile product is perfect for various applications in the category of Other Function Interface ICs, offering customers exceptional value and benefits. Experience seamless integration, superior functionality, and unmatched precision with the TDP158RSBR. Elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the internal components of the IC, making it suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.27 V

The high maximum supply voltage capability of 1.27 V provides flexibility in different power supply configurations, enhancing the versatility of the IC.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB real estate and facilitates uniform distribution of heat for optimal performance.

No. of Terminals: 40

Having 40 terminals enables the IC to support multiple connections and interfaces, increasing its functionality and compatibility with various devices.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides efficient heat dissipation, compact design, and compatibility with space-constrained applications.

Minimum Supply Voltage: 1 V

The low minimum supply voltage requirement of 1 V ensures efficient power consumption and operation, making the IC energy-efficient.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the IC can withstand elevated temperatures and harsh environmental conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable operation even in cold conditions, making the IC suitable for a wide range of environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term performance.

Terminal Position: QUAD

The quad terminal position allows for multiple connections and interfaces, enhancing the versatility and functionality of the IC.

Maximum Seated Height: 0.8 mm

The maximum seated height of 0.8 mm enables the IC to be used in compact devices and space-limited applications, making it a versatile choice for various design requirements.

Width: 5 mm

The compact width of 5 mm facilitates efficient PCB layout and integration, saving space and supporting dense electronic designs.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the IC can undergo robust soldering processes without compromising its integrity.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures reliable soldering and assembly of the IC on PCBs, contributing to the overall quality and longevity of the product.

Length: 5 mm

The compact length of 5 mm facilitates efficient PCB layout and integration, saving space and supporting dense electronic designs.

No. of Channels: 4

Having 4 channels allows the IC to support multiple data or signal pathways, enabling versatile communication and functionality in a variety of applications.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint failures and ensures long-term reliability in a range of operating conditions.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1 V provides a stable operating voltage for the IC, ensuring consistent performance and compatibility with various power sources.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4 mm allows for high-density mounting and compact PCB design, making the IC suitable for space-constrained applications.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, the IC can withstand moderate exposure to moisture during storage and handling, ensuring reliability and longevity in humid environments.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit IC, it enables seamless communication and data exchange between different components or systems, enhancing connectivity and interoperability in diverse applications.

Technical Specifications

Other Function Interface ICs TDP158RSBR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO HAVE 3 NOM AND 3.6 MAX AND 3.3 NOM INPUT AND ALSO HAVE 313 MIN AND 3.47 MAX AND 3.3 NOM INPUT

Interface IC Type:

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

1.27 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TDP158RSBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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