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TAS5508BPAGG4

Texas Instruments

TAS5508BPAGG4 by Texas Instruments

TAS5508BPAGG4 by Texas Instruments is a 64-terminal consumer IC with 3.3V power supply, operating b/w 0-70°C. It features a flatpack package style, suitable for various consumer circuit applications requiring a thin profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,840 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,840

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Digiode

USA . 4,148 parts In-Stock

1+ parts

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-

1k+ parts

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4,148

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 446 parts In-Stock

1+ parts

$1.068

100+ parts

-

1k+ parts

$1.921

10k+ parts

-

446

$1.068

-

$1.921

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ChromeModa Solutions

Germany . 6,709 parts In-Stock

1+ parts

$1.200

100+ parts

$0.984

1k+ parts

-

10k+ parts

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6,709

$1.200

$0.984

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IDEA Electronic Components Group

UK . 753 parts In-Stock

1+ parts

$1.200

100+ parts

-

1k+ parts

$1.080

10k+ parts

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753

$1.200

-

$1.080

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AZTECH Wire

Italy . 896 parts In-Stock

1+ parts

$5.096

100+ parts

-

1k+ parts

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10k+ parts

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896

$5.096

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One Stop Electronics

USA . 1,531 parts In-Stock

1+ parts

$14.800

100+ parts

-

1k+ parts

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10k+ parts

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1,531

$14.800

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Microchip USA

USA . 3,319 parts In-Stock

1+ parts

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3,319

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Corphita

USA . 1,746 parts In-Stock

1+ parts

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1,746

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DigiPath Technology Company

USA . 1,198 parts In-Stock

1+ parts

-

100+ parts

$1.082

1k+ parts

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10k+ parts

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1,198

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$1.082

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Perfect Parts

USA . 150 parts In-Stock

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150

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Cyclops Electronics Ltd (Excess)

UK . 67 parts In-Stock

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67

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Overview

Unlock a world of possibilities with the TAS5508BPAGG4 by Texas Instruments, a high-quality consumer IC that promises exceptional performance and reliability. Designed by a trusted manufacturer, this cutting-edge product is perfect for a wide range of applications in various industries. With its advanced features and innovative design, this IC offers unmatched value, benefits, and advantages to customers looking to enhance their electronic devices. Experience the difference with Texas Instruments and take your projects to new heights with the TAS5508BPAGG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, making it suitable for consumer electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly of the IC onto circuit boards, saving time and labor costs during production.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easier to fit into tight spaces on a PCB layout.

Power Supplies (V): 3.3

Operating at a supply voltage of 3.3V makes the IC energy-efficient and suitable for low-power applications.

No. of Terminals: 64

With a high number of terminals, the IC can support a wide range of functions and connections, making it versatile for various consumer circuit applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even under demanding conditions, enhancing the product's durability and longevity.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish offers excellent corrosion resistance and conductivity, ensuring stable connections and signal transmission.

Width: 10 mm

The compact width of 10mm allows for space-saving integration into electronic devices without compromising functionality.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures reliable performance in typical consumer electronics usage scenarios, making it a suitable choice for consumer circuit applications.

Technical Specifications

Other Function Consumer ICs TAS5508BPAGG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TAS5508BPAGG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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