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TAS5504PAGRG4

Texas Instruments

TAS5504PAGRG4 by Texas Instruments

TAS5504PAGRG4 by Texas Instruments is a 64-terminal consumer IC with 3.3V power supply, operating b/w -20 to 70°C. It features a flatpack package style, suitable for various consumer circuit applications requiring a thin profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,873 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,873

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Digiode

USA . 2,007 parts In-Stock

1+ parts

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2,007

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 406 parts In-Stock

1+ parts

$2.783

100+ parts

-

1k+ parts

$3.269

10k+ parts

-

406

$2.783

-

$3.269

-

IDEA Electronic Components Group

UK . 2,280 parts In-Stock

1+ parts

$3.127

100+ parts

-

1k+ parts

$2.814

10k+ parts

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2,280

$3.127

-

$2.814

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ChromeModa Solutions

Germany . 406 parts In-Stock

1+ parts

$3.127

100+ parts

$2.564

1k+ parts

-

10k+ parts

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406

$3.127

$2.564

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AZTECH Wire

Italy . 630 parts In-Stock

1+ parts

$17.491

100+ parts

-

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630

$17.491

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One Stop Electronics

USA . 713 parts In-Stock

1+ parts

$17.800

100+ parts

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713

$17.800

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Corphita

USA . 4,680 parts In-Stock

1+ parts

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4,680

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DigiPath Technology Company

USA . 1,327 parts In-Stock

1+ parts

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100+ parts

$2.819

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1,327

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$2.819

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Microchip USA

USA . 155 parts In-Stock

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155

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Overview

Elevate your consumer electronics with the TAS5504PAGRG4 by Texas Instruments. This high-quality IC offers unmatched performance and reliability, thanks to its renowned manufacturer. Perfect for a wide range of applications, this IC delivers exceptional value, benefits, and advantages to customers looking to enhance their products. Trust Texas Instruments to provide top-notch solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the IC, making it a reliable choice for consumer applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V ensures compatibility with a wide range of systems and devices.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for various inputs and outputs, making the IC versatile and adaptable to different configurations.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand high temperatures without compromising performance, suitable for a variety of environments.

Minimum Operating Temperature: -20 °C

Being able to operate at temperatures as low as -20°C makes this IC suitable for use in cold conditions, expanding its range of applications.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the IC has a higher resistance to moisture, ensuring reliability in humid or wet conditions.

Technical Specifications

Other Function Consumer ICs TAS5504PAGRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TAS5504PAGRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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