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TAS5504APAGRG4

Texas Instruments

TAS5504APAGRG4 by Texas Instruments

TAS5504APAGRG4 by Texas Instruments is a 64-terminal consumer IC with 3.3V power supply, suitable for various consumer circuit applications. It features a flatpack package style, nickel palladium gold terminal finish, and operates b/w 0-70°C temperature range. Ideal for compact electronic devices requiring high performance in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,840

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-

-

-

Digiode

USA . 3,568 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,568

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,930 parts In-Stock

1+ parts

$3.453

100+ parts

-

1k+ parts

$3.978

10k+ parts

-

1,930

$3.453

-

$3.978

-

DigiPath Technology Company

USA . 637 parts In-Stock

1+ parts

$3.802

100+ parts

$3.498

1k+ parts

-

10k+ parts

-

637

$3.802

$3.498

-

-

ChromeModa Solutions

Germany . 2,729 parts In-Stock

1+ parts

$3.880

100+ parts

$3.182

1k+ parts

-

10k+ parts

-

2,729

$3.880

$3.182

-

-

IDEA Electronic Components Group

UK . 520 parts In-Stock

1+ parts

$3.880

100+ parts

-

1k+ parts

$3.492

10k+ parts

-

520

$3.880

-

$3.492

-

AZTECH Wire

Italy . 810 parts In-Stock

1+ parts

$5.523

100+ parts

-

1k+ parts

-

10k+ parts

-

810

$5.523

-

-

-

One Stop Electronics

USA . 1,404 parts In-Stock

1+ parts

$12.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,404

$12.800

-

-

-

Corphita

USA . 1,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,120

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-

-

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Microchip USA

USA . 362 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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362

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-

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-

Overview

Experience exceptional quality and performance with the TAS5504APAGRG4 by Texas Instruments. Known for their innovation and reliability, Texas Instruments delivers top-of-the-line consumer ICs like this one that are perfect for a wide range of applications. This product offers unmatched value with its advanced features and benefits, making it a must-have for customers looking for superior electronic components. Trust Texas Instruments to provide you with the best in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in IC packages as it provides a good balance of strength, thermal conductivity, and cost-effectiveness.

Surface Mount: YES

Surface mount packaging allows for easy assembly onto PCBs, making it suitable for mass production and compact designs.

No. of Terminals: 64

Having a higher number of terminals allows for more connectivity options and functionality in the circuit.

Maximum Operating Temperature: 70 °C

With a relatively high maximum operating temperature, this IC can withstand extended use in various environmental conditions.

Minimum Operating Temperature: 0 °C

The wide operating temperature range makes this IC suitable for both indoor and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides good electrical conductivity and corrosion resistance, ensuring reliable performance over time.

Width: 10 mm

The compact width of this IC allows for space-saving designs in electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time required during assembly helps in reducing manufacturing time and costs.

Technical Specifications

Other Function Consumer ICs TAS5504APAGRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TAS5504APAGRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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