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TAS5036IPFCR

Texas Instruments

TAS5036IPFCR by Texas Instruments

TAS5036IPFCR by Texas Instruments is a consumer IC with 80 terminals in a square package. It operates b/w 0-70°C, with Vsup ranging from 3-3.6V. The IC is used in various consumer circuits due to its thin profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,146

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-

-

-

Digiode

USA . 3,018 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,018

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 480 parts In-Stock

1+ parts

$1.368

100+ parts

-

1k+ parts

$2.090

10k+ parts

-

480

$1.368

-

$2.090

-

DigiPath Technology Company

USA . 1,875 parts In-Stock

1+ parts

$1.506

100+ parts

$1.386

1k+ parts

-

10k+ parts

-

1,875

$1.506

$1.386

-

-

ChromeModa Solutions

Germany . 4,755 parts In-Stock

1+ parts

$1.537

100+ parts

$1.260

1k+ parts

-

10k+ parts

-

4,755

$1.537

$1.260

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-

IDEA Electronic Components Group

UK . 411 parts In-Stock

1+ parts

$1.537

100+ parts

-

1k+ parts

$1.383

10k+ parts

-

411

$1.537

-

$1.383

-

One Stop Electronics

USA . 1,466 parts In-Stock

1+ parts

$6.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,466

$6.800

-

-

-

AZTECH Wire

Italy . 889 parts In-Stock

1+ parts

$19.745

100+ parts

-

1k+ parts

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10k+ parts

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889

$19.745

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-

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Corphita

USA . 3,164 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,164

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Microchip USA

USA . 442 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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442

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Overview

Experience the cutting-edge technology of the TAS5036IPFCR by Texas Instruments, a top-quality consumer circuit that offers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this versatile IC is designed for a wide range of applications, delivering superior functionality and precision. With its innovative features and advanced design, the TAS5036IPFCR provides exceptional value to customers, making it the ideal choice for your electronic projects. Trust Texas Instruments for excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable, this product is suitable for automated assembly processes, increasing efficiency.

Package Shape: SQUARE

The square package shape allows for easier handling and integration into circuit designs.

No. of Terminals: 80

With a high number of terminals, this product offers versatility in connecting various external components.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures stable performance in a variety of environmental conditions.

Width: 12 mm

The compact width makes this product suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement ensures energy efficiency in operation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes this product suitable for reflow soldering processes.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this product is suitable for standard commercial applications.

Technical Specifications

Other Function Consumer ICs TAS5036IPFCR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TAS5036IPFCR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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