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TAS5036APFCRG4

Texas Instruments

TAS5036APFCRG4 by Texas Instruments

TAS5036APFCRG4 by Texas Instruments is a 3.3V CONSUMER CIRCUIT IC with 80 terminals in a FLATPACK package. Operating from 0°C to 70°C, it's ideal for consumer electronics applications requiring a compact design and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,812 parts In-Stock

1+ parts

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4,812

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Vyrian

USA . 1,984 parts In-Stock

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1,984

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,267 parts In-Stock

1+ parts

$0.390

100+ parts

-

1k+ parts

$1.582

10k+ parts

-

1,267

$0.390

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$1.582

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DigiPath Technology Company

USA . 809 parts In-Stock

1+ parts

$0.429

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809

$0.429

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IDEA Electronic Components Group

UK . 1,324 parts In-Stock

1+ parts

$0.438

100+ parts

-

1k+ parts

$0.394

10k+ parts

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1,324

$0.438

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$0.394

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ChromeModa Solutions

Germany . 1,044 parts In-Stock

1+ parts

$0.438

100+ parts

$0.359

1k+ parts

-

10k+ parts

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1,044

$0.438

$0.359

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AZTECH Wire

Italy . 221 parts In-Stock

1+ parts

$10.868

100+ parts

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221

$10.868

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One Stop Electronics

USA . 1,035 parts In-Stock

1+ parts

$18.800

100+ parts

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1,035

$18.800

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QUARKTWIN TECHNOLOGY LTD

USA . 11,163 parts In-Stock

1+ parts

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11,163

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Corphita

USA . 3,575 parts In-Stock

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3,575

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Microchip USA

USA . 345 parts In-Stock

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345

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Overview

Elevate your consumer electronics with the TAS5036APFCRG4 by Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers reliable solutions for a wide range of applications in the consumer electronics industry. This versatile IC offers unmatched value, providing customers with enhanced performance, efficiency, and functionality. Experience the benefits of Texas Instruments' expertise and innovation with the TAS5036APFCRG4, the perfect choice for your next electronics project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape provides efficient use of space on the PCB, allowing for more components to be included in a limited area.

Power Supplies (V): 3.3

Operating at 3.3V ensures compatibility with standard power supplies, making integration into existing systems seamless.

No. of Terminals: 80

Having 80 terminals provides flexibility in connecting to various components and peripherals, allowing for versatile functionality.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high operational conditions, ensuring reliable performance in demanding environments.

Minimum Operating Temperature: 0 °C

Operating at temperatures as low as 0°C allows for use in a wide range of environments, from industrial settings to commercial applications.

Terminal Position: QUAD

Quad terminal position provides stability and secure connections, reducing the risk of signal loss or interference.

Width: 12 mm

Narrow width of 12 mm saves space on the PCB, allowing for compact and efficient design layouts.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for reliability and performance, making it a suitable choice for various consumer applications.

Technical Specifications

Other Function Consumer ICs TAS5036APFCRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

TAS5036APFCRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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