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TAS5036APFCG4

Texas Instruments

TAS5036APFCG4 by Texas Instruments

TAS5036APFCG4 by Texas Instruments is a 3.3V consumer IC with 80 terminals in a square package. It operates b/w 0-70°C, suitable for commercial applications. The flatpack design with gull wing terminals and thin profile makes it ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,345 parts In-Stock

1+ parts

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7,345

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Digiode

USA . 1,226 parts In-Stock

1+ parts

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1,226

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,444 parts In-Stock

1+ parts

$3.002

100+ parts

-

1k+ parts

$3.508

10k+ parts

-

1,444

$3.002

-

$3.508

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DigiPath Technology Company

USA . 273 parts In-Stock

1+ parts

$3.306

100+ parts

-

1k+ parts

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273

$3.306

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ChromeModa Solutions

Germany . 2,089 parts In-Stock

1+ parts

$3.373

100+ parts

$2.766

1k+ parts

-

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2,089

$3.373

$2.766

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IDEA Electronic Components Group

UK . 1,644 parts In-Stock

1+ parts

$3.373

100+ parts

-

1k+ parts

$3.036

10k+ parts

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1,644

$3.373

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$3.036

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AZTECH Wire

Italy . 249 parts In-Stock

1+ parts

$19.364

100+ parts

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249

$19.364

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One Stop Electronics

USA . 840 parts In-Stock

1+ parts

$20.800

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840

$20.800

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Corphita

USA . 1,840 parts In-Stock

1+ parts

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1,840

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Microchip USA

USA . 423 parts In-Stock

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423

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Overview

Elevate your consumer electronics with the TAS5036APFCG4 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions for various applications in the consumer IC category. This sleek and compact flatpack offers a thin profile and fine pitch design, making it ideal for space-constrained projects. With a supply voltage range of 3V to 3.6V, this versatile IC ensures efficient performance while operating at temperatures between 0°C to 70°C. Upgrade your products with the TAS5036APFCG4 and experience the value and benefits that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight construction, making it suitable for consumer electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and cost in manufacturing.

Power Supplies (V): 3.3

Operating at 3.3 volts offers compatibility with a wide range of electronic systems and ensures efficient power consumption.

No. of Terminals: 80

Having 80 terminals provides ample connectivity options, enabling the IC to interface with multiple components for versatile functionality.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand high temperature environments without compromising performance.

Width: 12 mm

The compact width of 12mm allows for space-saving integration in electronic devices with limited board space.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density packaging, contributing to miniaturization of electronic products.

Technical Specifications

Other Function Consumer ICs TAS5036APFCG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

TAS5036APFCG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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