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SNJ54LVTH574FK

Texas Instruments

SNJ54LVTH574FK by Texas Instruments

SNJ54LVTH574FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.9 ns at 3.3V, suitable for military applications. It features a max frequency of 150MHz, operates b/w -55 to 125°C, and has a low power supply current of 5mA.

Median Price

$48.300

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,226 parts In-Stock

1+ parts

$44.697

100+ parts

$39.731

1k+ parts

$29.214

10k+ parts

-

4,226

$44.697

$39.731

$29.214

-

Rochester

USA . 73 parts In-Stock

1+ parts

-

100+ parts

$48.300

1k+ parts

$43.210

10k+ parts

$40.670

73

-

$48.300

$43.210

$40.670

DigiKey

USA . 73 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

73

-

-

-

-

Verical

USA . 73 parts In-Stock

1+ parts

-

100+ parts

$60.375

1k+ parts

$54.013

10k+ parts

$50.837

73

-

$60.375

$54.013

$50.837

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,702 parts In-Stock

1+ parts

$42.462

100+ parts

-

1k+ parts

-

10k+ parts

-

4,702

$42.462

-

-

-

Vyrian

USA . 3,949 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,949

-

-

-

-

Mil-Aero Solutions, Inc.

USA . 527 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

527

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 230 parts In-Stock

1+ parts

$4.311

100+ parts

-

1k+ parts

$4.139

10k+ parts

$4.139

230

$4.311

-

$4.139

$4.139

Parana Technologies

USA . 1,991 parts In-Stock

1+ parts

$30.222

100+ parts

-

1k+ parts

$68.510

10k+ parts

-

1,991

$30.222

-

$68.510

-

DigiPath Technology Company

USA . 422 parts In-Stock

1+ parts

$33.278

100+ parts

-

1k+ parts

-

10k+ parts

-

422

$33.278

-

-

-

IDEA Electronic Components Group

UK . 2,311 parts In-Stock

1+ parts

$33.957

100+ parts

$32.259

1k+ parts

$30.561

10k+ parts

-

2,311

$33.957

$32.259

$30.561

-

ChromeModa Solutions

Germany . 925 parts In-Stock

1+ parts

$33.957

100+ parts

$27.845

1k+ parts

-

10k+ parts

-

925

$33.957

$27.845

-

-

Ampacity Inc.

Singapore . 1,096 parts In-Stock

1+ parts

$37.990

100+ parts

-

1k+ parts

-

10k+ parts

-

1,096

$37.990

-

-

-

Corphita

USA . 4,861 parts In-Stock

1+ parts

$40.227

100+ parts

-

1k+ parts

-

10k+ parts

-

4,861

$40.227

-

-

-

Microchip USA

USA . 1,946 parts In-Stock

1+ parts

$99.520

100+ parts

$97.790

1k+ parts

$96.920

10k+ parts

$96.060

1,946

$99.520

$97.790

$96.920

$96.060

Overview

Enhance your electronic designs with the SNJ54LVTH574FK by Texas Instruments, a top-of-the-line Bus Driver & Transceiver that ensures superior performance and reliability. Manufactured with precision using high-quality materials, this product offers seamless integration and optimal functionality in various applications. With fast propagation delay and 3-STATE output characteristics, this chip carrier package delivers unmatched efficiency and versatility. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations and elevates your projects to new heights. Experience the power of innovation with the SNJ54LVTH574FK.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides a high level of durability and protection for the internal components of the bus driver & transceivers, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 4.9 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Output Characteristics: 3-STATE

The 3-STATE output allows the bus driver & transceivers to effectively control the flow of data on the bus, providing flexibility in the system design.

Technology: BICMOS

BICMOS technology offers a good balance between speed and power consumption, making the bus driver & transceivers efficient in operation.

Maximum Frequency At Nominal Supply: 150000000 Hz

High maximum frequency capability allows the bus driver & transceivers to support high-speed data communication requirements in modern systems.

Technical Specifications

Bus Driver & Transceivers SNJ54LVTH574FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 374

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

5.9 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Trade Compliance

SNJ54LVTH574FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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