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SNJ54LVTH573FK

Texas Instruments

SNJ54LVTH573FK by Texas Instruments

SNJ54LVTH573FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.5 ns at 3.3V, suitable for military-grade applications. It features a 3-STATE output and operates within a temperature range of -55 to 125°C, making it ideal for high-reliability systems requiring fast signal transmission. The chip carrier package style with ceramic body material ensures robust performance in harsh environments.

Median Price

$45.074

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,288 parts In-Stock

1+ parts

$45.074

100+ parts

$40.066

1k+ parts

$29.460

10k+ parts

-

2,288

$45.074

$40.066

$29.460

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,468 parts In-Stock

1+ parts

$42.820

100+ parts

-

1k+ parts

-

10k+ parts

-

3,468

$42.820

-

-

-

Vyrian

USA . 2,869 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,869

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 326 parts In-Stock

1+ parts

$8.750

100+ parts

-

1k+ parts

-

10k+ parts

-

326

$8.750

-

-

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Andel Nordic

Denmark . 4,416 parts In-Stock

1+ parts

$9.361

100+ parts

-

1k+ parts

$8.986

10k+ parts

$8.986

4,416

$9.361

-

$8.986

$8.986

Parana Technologies

USA . 899 parts In-Stock

1+ parts

$10.288

100+ parts

-

1k+ parts

$10.818

10k+ parts

-

899

$10.288

-

$10.818

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ChromeModa Solutions

Germany . 3,788 parts In-Stock

1+ parts

$11.560

100+ parts

$9.479

1k+ parts

-

10k+ parts

-

3,788

$11.560

$9.479

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IDEA Electronic Components Group

UK . 1,756 parts In-Stock

1+ parts

$11.560

100+ parts

$10.982

1k+ parts

$10.404

10k+ parts

-

1,756

$11.560

$10.982

$10.404

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Corphita

USA . 362 parts In-Stock

1+ parts

$40.567

100+ parts

-

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-

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362

$40.567

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-

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Ampacity Inc.

Singapore . 1,961 parts In-Stock

1+ parts

$83.390

100+ parts

-

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1,961

$83.390

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DigiPath Technology Company

USA . 2,004 parts In-Stock

1+ parts

-

100+ parts

$10.422

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-

10k+ parts

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2,004

-

$10.422

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Microchip USA

USA . 1,139 parts In-Stock

1+ parts

-

100+ parts

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1,139

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Overview

Experience top-of-the-line performance with the Texas Instruments SNJ54LVTH573FK, a premium bus driver and transceiver designed for reliability and precision. Manufactured with superior quality materials and cutting-edge technology, this chip carrier package offers 8 bits of seamless connectivity with a fast propagation delay of just 4.5 ns. Perfect for military-grade applications, this 3-STATE output device ensures optimal performance even in extreme temperatures ranging from -55 to 125°C. Trust Texas Instruments to deliver unmatched value and efficiency with the SNJ54LVTH573FK.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, making the product suitable for rugged environments.

Propagation Delay At Nominal Supply: 4.5 ns

Low propagation delay ensures fast data transmission, making the product efficient for communication applications.

Surface Mount: YES

Surface mount capability makes installation easier and saves space on PCBs.

Screening Level: MIL-PRF-38535

Compliance with military screening standards ensures high quality and reliability in critical applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making integration into existing systems seamless.

Output Characteristics: 3-STATE

3-state output allows for high flexibility in controlling bus lines, enabling efficient data transmission.

Technology: BICMOS

BICMOS technology combines the speed of bipolar transistors with the low power capabilities of CMOS, offering a balanced performance.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments without performance degradation, suitable for industrial applications.

Technical Specifications

Bus Driver & Transceivers SNJ54LVTH573FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

5.4 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ54LVTH573FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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