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SNJ54LVTH373FK

Texas Instruments

SNJ54LVTH373FK by Texas Instruments

SNJ54LVTH373FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.1 ns at 3.3V, suitable for military-grade applications. It features a 3-STATE output and operates within a temperature range of -55 to 125°C, making it ideal for high-reliability systems requiring fast signal transmission. The chip carrier package with ceramic body material ensures robust performance in harsh environments.

Median Price

$47.167

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,239 parts In-Stock

1+ parts

$47.167

100+ parts

$41.926

1k+ parts

$30.828

10k+ parts

-

1,239

$47.167

$41.926

$30.828

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,865 parts In-Stock

1+ parts

$44.809

100+ parts

-

1k+ parts

-

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4,865

$44.809

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Vyrian

USA . 3,306 parts In-Stock

1+ parts

-

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3,306

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 373 parts In-Stock

1+ parts

$6.144

100+ parts

-

1k+ parts

$5.898

10k+ parts

$5.898

373

$6.144

-

$5.898

$5.898

AZTECH Wire

Italy . 852 parts In-Stock

1+ parts

$8.380

100+ parts

-

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852

$8.380

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Parana Technologies

USA . 2,346 parts In-Stock

1+ parts

$16.706

100+ parts

-

1k+ parts

$16.963

10k+ parts

-

2,346

$16.706

-

$16.963

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DigiPath Technology Company

USA . 1,689 parts In-Stock

1+ parts

$18.396

100+ parts

-

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-

10k+ parts

-

1,689

$18.396

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ChromeModa Solutions

Germany . 5,714 parts In-Stock

1+ parts

$18.771

100+ parts

$15.392

1k+ parts

-

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5,714

$18.771

$15.392

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IDEA Electronic Components Group

UK . 179 parts In-Stock

1+ parts

$18.771

100+ parts

$17.832

1k+ parts

$16.894

10k+ parts

-

179

$18.771

$17.832

$16.894

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Corphita

USA . 4,120 parts In-Stock

1+ parts

$42.450

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4,120

$42.450

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Microchip USA

USA . 3,261 parts In-Stock

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3,261

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Overview

Unlock seamless data transmission with the Texas Instruments SNJ54LVTH373FK Bus Driver & Transceiver. Crafted with precision using top-notch materials, this innovative chip carrier package ensures reliable performance in military-grade applications. With a low propagation delay of 4.1 ns and true output polarity, this 8-bit transceiver offers unmatched speed and accuracy. Enhance your systems with the power of Texas Instruments and experience superior connectivity like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and high performance in various operating conditions, making the product suitable for rugged environments.

Propagation Delay At Nominal Supply: 4.1 ns

Low propagation delay allows for quick signal transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Being surface mountable means easy integration into compact electronic designs, saving space and simplifying assembly processes.

Screening Level: MIL-PRF-38535

Compliance with a stringent screening standard ensures reliability and high performance, making this product suitable for critical applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage ensures compatibility with a wide range of systems and devices.

Output Characteristics: 3-STATE

The 3-STATE output feature allows for high flexibility in controlling output signals, enabling efficient communication protocols.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, resulting in improved performance and efficiency.

Technical Specifications

Bus Driver & Transceivers SNJ54LVTH373FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

5.1 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ54LVTH373FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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