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SNJ54LVC374AFK

Texas Instruments

SNJ54LVC374AFK by Texas Instruments

SNJ54LVC374AFK by Texas Instruments is an 8-bit bus driver with a propagation delay of 8.5 ns and operates at a max frequency of 100MHz. It features a MILITARY temperature grade, TRUE output polarity, and is suitable for applications requiring low power consumption and high-speed data transmission in military-grade environments.

Median Price

$36.748

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,885 parts In-Stock

1+ parts

$36.748

100+ parts

$32.664

1k+ parts

$24.018

10k+ parts

-

1,885

$36.748

$32.664

$24.018

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,862 parts In-Stock

1+ parts

$34.911

100+ parts

-

1k+ parts

-

10k+ parts

-

2,862

$34.911

-

-

-

Vyrian

USA . 6,235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,235

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,151 parts In-Stock

1+ parts

$7.542

100+ parts

-

1k+ parts

$7.240

10k+ parts

$7.240

3,151

$7.542

-

$7.240

$7.240

Parana Technologies

USA . 470 parts In-Stock

1+ parts

$9.474

100+ parts

-

1k+ parts

$10.083

10k+ parts

-

470

$9.474

-

$10.083

-

AZTECH Wire

Italy . 1,007 parts In-Stock

1+ parts

$9.790

100+ parts

-

1k+ parts

-

10k+ parts

-

1,007

$9.790

-

-

-

DigiPath Technology Company

USA . 1,947 parts In-Stock

1+ parts

$10.432

100+ parts

$9.598

1k+ parts

-

10k+ parts

-

1,947

$10.432

$9.598

-

-

Advanced Electronics

New Zealand . 800 parts In-Stock

1+ parts

$10.615

100+ parts

$10.509

1k+ parts

$10.085

10k+ parts

-

800

$10.615

$10.509

$10.085

-

ChromeModa Solutions

Germany . 2,651 parts In-Stock

1+ parts

$10.645

100+ parts

$8.729

1k+ parts

-

10k+ parts

-

2,651

$10.645

$8.729

-

-

IDEA Electronic Components Group

UK . 1,080 parts In-Stock

1+ parts

$10.645

100+ parts

$10.113

1k+ parts

$9.580

10k+ parts

-

1,080

$10.645

$10.113

$9.580

-

Corphita

USA . 3,391 parts In-Stock

1+ parts

$33.073

100+ parts

-

1k+ parts

-

10k+ parts

-

3,391

$33.073

-

-

-

Microchip USA

USA . 2,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,096

-

-

-

-

Overview

Elevate your electronics projects with the SNJ54LVC374AFK by Texas Instruments, a top-tier manufacturer renowned for quality and reliability. This bus driver & transceiver is versatile, offering seamless integration into various applications. With its advanced technology and military-grade screening level, this chip carrier ensures optimal performance even in challenging environments. Experience faster propagation delays, reduced power consumption, and true output polarity – all at an unbeatable value. Choose Texas Instruments for cutting-edge solutions that elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent durability and reliability, making this product suitable for harsh environments.

Propagation Delay At Nominal Supply: 8.5 ns

The low propagation delay ensures fast signal transmission, making this product ideal for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly, making this product convenient for manufacturing processes.

Screening Level: MIL-PRF-38535

The MIL-PRF-38535 screening level ensures high quality and reliability of the product, making it suitable for military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 2.7

The low nominal supply voltage reduces power consumption, making this product energy-efficient.

Output Characteristics: 3-STATE

The 3-state output characteristics provide flexibility in controlling the output signal, making this product versatile in various applications.

Maximum Frequency At Nominal Supply: 100000000 Hz

The high maximum frequency capability allows for efficient signal processing, making this product suitable for high-frequency applications.

Technical Specifications

Bus Driver & Transceivers SNJ54LVC374AFK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

100000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Trade Compliance

SNJ54LVC374AFK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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