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SNJ54LS688W

Texas Instruments

SNJ54LS688W by Texas Instruments

SNJ54LS688W by Texas Instruments is an 8-bit digital arithmetic circuit with a propagation delay of 23ns at 5V. It features Schmitt Trigger technology, operates in a temperature range of -55 to 125°C, and has a max power supply current of 65mA. Ideal for military applications requiring fast arithmetic processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,367 parts In-Stock

1+ parts

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5,367

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Digiode

USA . 426 parts In-Stock

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426

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Distributors (Availability)

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Andel Nordic

Denmark . 2,701 parts In-Stock

1+ parts

$4.969

100+ parts

-

1k+ parts

$4.770

10k+ parts

$4.770

2,701

$4.969

-

$4.770

$4.770

One Stop Electronics

USA . 460 parts In-Stock

1+ parts

$16.000

100+ parts

-

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460

$16.000

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AZTECH Wire

Italy . 313 parts In-Stock

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$18.624

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313

$18.624

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Parana Technologies

USA . 1,068 parts In-Stock

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$27.704

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$38.960

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1,068

$27.704

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$38.960

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DigiPath Technology Company

USA . 1,036 parts In-Stock

1+ parts

$30.505

100+ parts

$28.065

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1,036

$30.505

$28.065

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IDEA Electronic Components Group

UK . 383 parts In-Stock

1+ parts

$31.128

100+ parts

$29.572

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$28.015

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383

$31.128

$29.572

$28.015

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ChromeModa Solutions

Germany . 35 parts In-Stock

1+ parts

$31.128

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$25.525

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35

$31.128

$25.525

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Microchip USA

USA . 2,605 parts In-Stock

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Corphita

USA . 1,450 parts In-Stock

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Overview

Discover the high-quality SNJ54LS688W by Texas Instruments, a top-tier manufacturer known for producing cutting-edge digital arithmetic circuits. This versatile component offers customers unparalleled value with its fast propagation delay, inverted output polarity, and military-grade temperature grade. Ideal for a wide range of applications, this product provides reliability and performance that exceed expectations. Upgrade your projects with the SNJ54LS688W and experience the advantages of Texas Instruments' innovative technology firsthand.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent durability and protection for the circuit, ensuring reliable performance even in harsh environments.

Propagation Delay At Nominal Supply: 23 ns

The low propagation delay allows for quick processing of digital signals, making this product suitable for applications requiring high speed operation.

Surface Mount: YES

Surface mount capability makes installation and assembly easier, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage simplifies integration with other digital systems and components.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can reliably function in demanding conditions without overheating.

Technical Specifications

Digital Arithmetic Circuits SNJ54LS688W attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

Length:

13.09 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

65 mA

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

23 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.45 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.92 mm

Trade Compliance

SNJ54LS688W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-431-4352, 5962014314352

NIIN

014314352

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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