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SNJ54LS173AFK

Texas Instruments

SNJ54LS173AFK by Texas Instruments

SNJ54LS173AFK by Texas Instruments is a 4-bit latches & flip-flops chip with 30ns propagation delay, operating at 5V. It features a ceramic, metal-sealed cofired package and MIL-PRF-38535 screening level. Ideal for military-grade applications requiring positive edge triggering and 3-state output characteristics.

Median Price

$26.876

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 76 parts In-Stock

1+ parts

-

100+ parts

$23.890

1k+ parts

$21.380

10k+ parts

$20.120

76

-

$23.890

$21.380

$20.120

DigiKey

USA . 76 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

76

-

-

-

-

Verical

USA . 41 parts In-Stock

1+ parts

-

100+ parts

$29.863

1k+ parts

$26.725

10k+ parts

$25.150

41

-

$29.863

$26.725

$25.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,103 parts In-Stock

1+ parts

$21.926

100+ parts

-

1k+ parts

-

10k+ parts

-

4,103

$21.926

-

-

-

Vyrian

USA . 2,046 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,046

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 471 parts In-Stock

1+ parts

$4.943

100+ parts

-

1k+ parts

$4.746

10k+ parts

$4.746

471

$4.943

-

$4.746

$4.746

Component Stockers USA

USA . 2,358 parts In-Stock

1+ parts

$20.570

100+ parts

-

1k+ parts

$15.520

10k+ parts

-

2,358

$20.570

-

$15.520

-

Corphita

USA . 954 parts In-Stock

1+ parts

$20.772

100+ parts

-

1k+ parts

-

10k+ parts

-

954

$20.772

-

-

-

Parana Technologies

USA . 1,925 parts In-Stock

1+ parts

$30.246

100+ parts

-

1k+ parts

$68.777

10k+ parts

-

1,925

$30.246

-

$68.777

-

ChromeModa Solutions

Germany . 3,463 parts In-Stock

1+ parts

$33.984

100+ parts

$27.867

1k+ parts

-

10k+ parts

-

3,463

$33.984

$27.867

-

-

IDEA Electronic Components Group

UK . 5 parts In-Stock

1+ parts

$33.984

100+ parts

$32.285

1k+ parts

$30.586

10k+ parts

-

5

$33.984

$32.285

$30.586

-

Microchip USA

USA . 2,193 parts In-Stock

1+ parts

$49.150

100+ parts

$48.300

1k+ parts

$47.870

10k+ parts

$47.440

2,193

$49.150

$48.300

$47.870

$47.440

DigiPath Technology Company

USA . 462 parts In-Stock

1+ parts

-

100+ parts

$30.640

1k+ parts

-

10k+ parts

-

462

-

$30.640

-

-

Overview

Enhance your electronic projects with the SNJ54LS173AFK by Texas Instruments, a high-quality latch and flip-flop component. With Texas Instruments' renowned reputation for excellence in manufacturing, this product offers reliability and durability for various applications. Whether you're working on a DIY project or a professional circuit design, this versatile chip carrier package provides value, efficiency, and ease of use. Upgrade your creations today with the SNJ54LS173AFK and experience the benefits of top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired construction ensures high reliability and durability for the product.

Propagation Delay At Nominal Supply: 30 ns

Low propagation delay ensures fast and efficient operation of the latches and flip-flops.

Surface Mount: YES

The ability to be surface mounted makes installation and PCB assembly easier and more compact.

Screening Level: MIL-PRF-38535

Compliance with MIL-PRF-38535 standards ensures high quality and reliability for military applications.

Nominal Supply Voltage / Vsup (V): 5

Standard nominal supply voltage of 5V makes it compatible with a wide range of systems and applications.

Load Capacitance (CL): 45 pF

The specified load capacitance ensures stable and consistent performance under varying load conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for operation in harsh environmental conditions.

Technology: TTL

Use of TTL technology ensures reliable and robust digital signal processing capabilities.

Technical Specifications

Latches & Flip-Flops SNJ54LS173AFK attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

WITH HOLD MODE; WITH DUAL OUTPUT ENABLE; DISABLE TIME CL = 5PF

Family:

LS

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

30000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

24 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Minimum fmax:

30 MHz

Trade Compliance

SNJ54LS173AFK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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