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SNJ54100W-00

Texas Instruments

SNJ54100W-00 by Texas Instruments

SNJ54100W-00 by Texas Instruments is a TTL technology latches & flip-flops IC with 4 bits, 15 ns propagation delay, and 5V nominal voltage. It is used in military-grade applications for high-level trigger operations with a temperature range of -55 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,945 parts In-Stock

1+ parts

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7,945

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Digiode

USA . 1,999 parts In-Stock

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1,999

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 574 parts In-Stock

1+ parts

$5.038

100+ parts

-

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574

$5.038

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One Stop Electronics

USA . 1,294 parts In-Stock

1+ parts

$22.000

100+ parts

-

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1,294

$22.000

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Parana Technologies

USA . 2,289 parts In-Stock

1+ parts

$23.545

100+ parts

-

1k+ parts

$24.173

10k+ parts

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2,289

$23.545

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$24.173

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DigiPath Technology Company

USA . 2,258 parts In-Stock

1+ parts

$25.926

100+ parts

$23.852

1k+ parts

-

10k+ parts

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2,258

$25.926

$23.852

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ChromeModa Solutions

Germany . 4,073 parts In-Stock

1+ parts

$26.455

100+ parts

$21.693

1k+ parts

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10k+ parts

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4,073

$26.455

$21.693

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IDEA Electronic Components Group

UK . 420 parts In-Stock

1+ parts

$26.455

100+ parts

$25.132

1k+ parts

$23.810

10k+ parts

-

420

$26.455

$25.132

$23.810

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Corphita

USA . 4,169 parts In-Stock

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4,169

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Overview

Unlock the power of advanced technology with the SNJ54100W-00 from Texas Instruments. This high-quality latch and flip-flop device offers unmatched reliability and performance, making it the ideal choice for a wide range of applications. With its innovative design and superior craftsmanship, this product delivers exceptional value and benefits to customers seeking top-notch solutions for their electronic projects. Trust Texas Instruments to provide you with the best in class components for all your needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort.

No. of Functions: 2

Offers versatility and flexibility in circuit design by providing multiple functions in a single component.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supply, making it suitable for a wide range of applications.

Propagation Delay (tpd): 15 ns

Provides fast response time, ensuring efficient operation in time-critical applications.

Temperature Grade: MILITARY

Designed to meet rigorous military standards for performance and reliability in harsh environments.

Technical Specifications

Latches & Flip-Flops SNJ54100W-00 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F24

Length:

14.36 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

92 mA

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.29 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

HIGH LEVEL

Width:

9.09 mm

Trade Compliance

SNJ54100W-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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