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SNJ54107J-00

Texas Instruments

SNJ54107J-00 by Texas Instruments

SNJ54107J-00 by Texas Instruments is a TTL latch with 2 functions, 40 ns propagation delay, and 15 MHz min fmax. It is used in military applications due to its MILITARY temperature grade and NEGATIVE EDGE trigger type. The package style is IN-LINE with 14 terminals and a rectangular shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,656 parts In-Stock

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6,656

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Digiode

USA . 2,916 parts In-Stock

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2,916

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 287 parts In-Stock

1+ parts

$11.000

100+ parts

-

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287

$11.000

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AZTECH Wire

Italy . 354 parts In-Stock

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$12.747

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354

$12.747

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Parana Technologies

USA . 1,319 parts In-Stock

1+ parts

$13.750

100+ parts

$1,276.860

1k+ parts

$12.375

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1,319

$13.750

$1,276.860

$12.375

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DigiPath Technology Company

USA . 256 parts In-Stock

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$15.140

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256

$15.140

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IDEA Electronic Components Group

UK . 2,166 parts In-Stock

1+ parts

$15.449

100+ parts

$14.677

1k+ parts

$13.904

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2,166

$15.449

$14.677

$13.904

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ChromeModa Solutions

Germany . 1,165 parts In-Stock

1+ parts

$15.449

100+ parts

$12.668

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1,165

$15.449

$12.668

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Corphita

USA . 4,449 parts In-Stock

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4,449

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Overview

Elevate your electronics projects with the SNJ54107J-00 by Texas Instruments. Designed with quality in mind, this latches & flip-flops device offers reliability and precision for a wide range of applications. With a package body material of ceramic and glass-sealed, and featuring negative edge trigger type, this component delivers high performance in demanding environments. Experience the value and benefits of Texas Instruments' expertise in technological innovation with the SNJ54107J-00, providing customers with top-notch functionality and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Functions: 2

Offers dual functionality in a single component, increasing versatility and efficiency.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with many existing systems.

Propagation Delay (tpd): 40 ns

Provides fast response times, critical for applications requiring quick signal processing.

Trigger Type: NEGATIVE EDGE

Allows for precise timing control, essential for applications where timing is crucial.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for various operating environments.

Technology: TTL

Utilizes TTL technology known for its reliability and compatibility with a wide range of systems.

Technical Specifications

Latches & Flip-Flops SNJ54107J-00 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay (tpd):

40 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

7.62 mm

Minimum fmax:

15 MHz

Trade Compliance

SNJ54107J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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