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SNJ54HC273W

Texas Instruments

SNJ54HC273W by Texas Instruments

SNJ54HC273W by Texas Instruments is an 8-bit latches & flip-flops IC with a propagation delay of 48ns. Operating at a supply voltage range of 2-6V, it has a max frequency of 18MHz and is MILITARY grade suitable for high-temp applications. With positive edge trigger, this CMOS technology chip is ideal for military-grade electronics requiring fast data storage and retrieval.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,760 parts In-Stock

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2,760

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Digiode

USA . 227 parts In-Stock

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227

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Distributors (Availability)

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Parana Technologies

USA . 1,786 parts In-Stock

1+ parts

$14.634

100+ parts

-

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$15.072

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1,786

$14.634

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$15.072

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ChromeModa Solutions

Germany . 4,345 parts In-Stock

1+ parts

$16.443

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$13.483

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4,345

$16.443

$13.483

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IDEA Electronic Components Group

UK . 2,072 parts In-Stock

1+ parts

$16.443

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$15.621

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$14.799

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2,072

$16.443

$15.621

$14.799

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AZTECH Wire

Italy . 203 parts In-Stock

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$18.392

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203

$18.392

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One Stop Electronics

USA . 811 parts In-Stock

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$50.000

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811

$50.000

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Corphita

USA . 3,718 parts In-Stock

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3,718

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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Microchip USA

USA . 2,706 parts In-Stock

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2,706

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DigiPath Technology Company

USA . 834 parts In-Stock

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$14.825

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834

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$14.825

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Overview

Enhance the performance of your electronic circuits with the SNJ54HC273W latches & flip-flops from Texas Instruments. Designed with precision and reliability, this product offers a seamless integration into a wide range of applications, providing exceptional quality and value to our customers. Whether you're working on military-grade equipment or industrial machinery, trust in the superior technology and craftsmanship that Texas Instruments is known for. Upgrade your projects today with the SNJ54HC273W and experience unparalleled efficiency and effectiveness like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and reliability, making the product suitable for use in harsh environments.

Propagation Delay At Nominal Supply: 48 ns

The low propagation delay ensures fast and efficient operation of the latch or flip-flop, making it suitable for high-speed applications.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and simplifying the overall design.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in industrial or military applications.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures reliable operation and accurate timing control of the latch or flip-flop.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, improving overall performance and efficiency.

Technical Specifications

Latches & Flip-Flops SNJ54HC273W attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

DUMMY VAL

Family:

HC/UH

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

Length:

13.09 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

18000000 Hz

Maximum I (ol):

5.2 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

48 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.92 mm

Minimum fmax:

21 MHz

Trade Compliance

SNJ54HC273W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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