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SNJ54HC245J

Texas Instruments

SNJ54HC245J by Texas Instruments

SNJ54HC245J by Texas Instruments is an 8-bit bus driver with a propagation delay of 22ns. It operates at a supply voltage range of 2-6V and has a max operating temperature of 125°C. Ideal for military applications requiring bidirectional control in CMOS technology.

Median Price

$16.888

Lifecycle Status

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Arrow

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Andel Nordic

Denmark . 2,958 parts In-Stock

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Corphita

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Parana Technologies

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DigiPath Technology Company

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Overview

Elevate your electronic projects with the SNJ54HC245J by Texas Instruments, a top-of-the-line bus driver & transceiver. Known for their high-quality products, Texas Instruments delivers reliability and performance with this ceramic, glass-sealed package. Whether you're designing communication systems or data processing equipment, this 8-bit transceiver offers fast propagation delay and true output polarity. With a military-grade screening level and wide operating temperature range, this versatile component is a must-have for any application requiring precision and efficiency. Experience the value and benefits that Texas Instruments brings to your projects with the SNJ54HC245J.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the components inside, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed applications.

Screening Level: MIL-PRF-38535

Meets military screening standards for reliability and performance, making it a reliable choice for critical applications.

Nominal Supply Voltage / Vsup (V): 6

Operating at a higher supply voltage allows for better signal integrity and performance, making it suitable for demanding environments.

Output Characteristics: 3-STATE

3-state outputs provide flexibility in controlling the output signals, allowing for efficient bus sharing and communication.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers SNJ54HC245J attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.2 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

6

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.92 mm

Trade Compliance

SNJ54HC245J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-203-9748, 5962012039748, 5962-01-202-4650, 5962012024650, 5962-01-315-4302, 5962013154302, 5962-01-189-4486, 5962011894486

NIIN

012039748, 012024650, 013154302, 011894486

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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