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SNJ54HC148J

Texas Instruments

SNJ54HC148J by Texas Instruments

SNJ54HC148J by Texas Instruments is an 8-bit digital arithmetic circuit with a propagation delay of 49ns at 5V. It operates in a temperature range of -55 to 125°C, making it suitable for military applications. With a max power supply current of 0.16mA and inverted output polarity, this CMOS technology device is ideal for high-speed data processing tasks.

Median Price

$10.065

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Freelance Electronics

USA . 12 parts In-Stock

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$10.569

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Vyrian

USA . 5,010 parts In-Stock

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Digiode

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Mil-Aero Solutions, Inc.

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Resion

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Andel Nordic

Denmark . 4,678 parts In-Stock

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$1.860

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$1.785

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AZTECH Wire

Italy . 570 parts In-Stock

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Parana Technologies

USA . 2,163 parts In-Stock

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DigiPath Technology Company

USA . 756 parts In-Stock

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ChromeModa Solutions

Germany . 5,901 parts In-Stock

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IDEA Electronic Components Group

UK . 142 parts In-Stock

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One Stop Electronics

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Microchip USA

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Overview

Elevate your digital arithmetic circuits with the SNJ54HC148J by Texas Instruments. Designed with quality and precision in mind, this product offers exceptional performance for a wide range of applications. From military-grade screening to a compact package style, this device delivers reliability and efficiency. With a maximum supply voltage of 6V and a propagation delay of just 49ns, the SNJ54HC148J provides quick and accurate results every time. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed packaging provides high reliability and durability, making this product suitable for harsh environments and extended use.

No. of Bits: 8

8 bits allow for a wide range of calculations and processing capabilities, making this product versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V ensures compatibility with common electronics and power systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures, making it suitable for industrial and military applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Digital Arithmetic Circuits SNJ54HC148J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT

Family:

HC/UH

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

49 ns

Propagation Delay (tpd):

285 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNJ54HC148J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-300-2093, 5962013002093

NIIN

013002093

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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