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SNJ54HC109J

Texas Instruments

SNJ54HC109J by Texas Instruments

SNJ54HC109J by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 58ns propagation delay, and 5V nominal voltage. It is MIL-PRF-38535 screened for military applications, featuring positive edge trigger type and complementary output polarity. Ideal for high-speed applications requiring reliable data storage and transfer.

Median Price

$15.258

Lifecycle Status

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TEDSS.com

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Freelance Electronics

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Vyrian

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Digiode

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Speed Components Ltd

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Bristol Electronics

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LWI Electronics Inc

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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A&K Electronics

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Rotakorn

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Mil-Aero Solutions, Inc.

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ECAB

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Manoshevitz Elec. Sales

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ComSIT Distribution GmbH

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Odintec Ltd.

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Component Sense

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Parana Technologies

USA . 984 parts In-Stock

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ChromeModa Solutions

Germany . 4,265 parts In-Stock

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IDEA Electronic Components Group

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One Stop Electronics

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AZTECH Wire

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Microchip USA

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DigiPath Technology Company

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Assy Fe

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Overview

Unleash the power of reliable and high-quality latches & flip-flops with the SNJ54HC109J by Texas Instruments. As a trusted manufacturer, Texas Instruments ensures top-notch performance and durability in every product they deliver. Whether you're working on military-grade applications or industrial projects, this component offers unmatched value and efficiency. With fast propagation delay and versatile functionality, the SNJ54HC109J is designed to meet your needs and exceed your expectations. Upgrade your designs with confidence and precision using this essential component from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and protection for the internal components, making this product suitable for rugged environments.

Propagation Delay At Nominal Supply: 58 ns

The low propagation delay ensures fast response times, making this latch and flip-flop efficient for time-critical applications.

No. of Functions: 2

Having two functions in one component allows for more functionality in a smaller footprint, saving space and simplifying circuit design.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to place and secure in circuit boards, ensuring a proper fit and alignment.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes integration with other components and systems seamless.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows this latch and flip-flop to be used in a wide range of temperature environments without performance degradation.

Technology: CMOS

The CMOS technology used in this product provides low power consumption and high noise immunity, making it an efficient and reliable choice for digital circuits.

Technical Specifications

Latches & Flip-Flops SNJ54HC109J attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

DUMMY VAL

Family:

HC

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

-4 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

58 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.92 mm

Minimum fmax:

20 MHz

Trade Compliance

SNJ54HC109J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-264-2981, 5962012642981

NIIN

012642981

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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