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SNJ54F373W

Texas Instruments

SNJ54F373W by Texas Instruments

SNJ54F373W by Texas Instruments is an 8-bit bus driver with a propagation delay of 8.5 ns at 5V, suitable for military-grade applications. It features a flatpack package style, operates b/w -55 to 125 °C, and has a max power supply current of 55 mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,006 parts In-Stock

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4,006

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Digiode

USA . 2,690 parts In-Stock

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2,690

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Distributors (Availability)

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Andel Nordic

Denmark . 5,099 parts In-Stock

1+ parts

$5.815

100+ parts

-

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$5.582

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$5.582

5,099

$5.815

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$5.582

$5.582

One Stop Electronics

USA . 396 parts In-Stock

1+ parts

$7.000

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-

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396

$7.000

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AZTECH Wire

Italy . 342 parts In-Stock

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$9.824

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342

$9.824

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Parana Technologies

USA . 2,002 parts In-Stock

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$20.509

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$20.576

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$20.509

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$20.576

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DigiPath Technology Company

USA . 496 parts In-Stock

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$22.583

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$20.776

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496

$22.583

$20.776

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ChromeModa Solutions

Germany . 2,537 parts In-Stock

1+ parts

$23.044

100+ parts

$18.896

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2,537

$23.044

$18.896

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IDEA Electronic Components Group

UK . 801 parts In-Stock

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$23.044

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$21.892

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$20.740

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801

$23.044

$21.892

$20.740

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Ampacity Inc.

Singapore . 886 parts In-Stock

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$30.000

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Component Stockers USA

USA . 646 parts In-Stock

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$99.990

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646

$99.990

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Lixinc

USA . 18,676 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 2,460 parts In-Stock

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Corphita

USA . 387 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality SNJ54F373W bus driver & transceiver from Texas Instruments. With a MILITARY-grade screening level and 3-STATE output characteristics, this versatile component offers reliable performance in a wide range of applications. From industrial automation to telecommunications, the SNJ54F373W provides efficient signal transmission, precise control, and seamless integration. Trust Texas Instruments for cutting-edge technology and superior products that deliver value and innovation to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent durability and reliability, making the product suitable for harsh environments.

Propagation Delay At Nominal Supply: 8.5 ns

Enables fast signal transmission, enhancing the overall performance of the bus driver & transceiver.

No. of Bits: 8

Suitable for handling data transmission with up to 8 bits, making it ideal for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard voltage level, ensuring compatibility with common systems.

Output Characteristics: 3-STATE

Allows the driver to be in one of three states (high, low, or high impedance), providing flexibility in controlling the output.

Temperature Grade: MILITARY

Designed to meet military specifications, ensuring ruggedness and reliability in challenging conditions.

Technology: TTL

Utilizes TTL technology known for its simplicity and robustness, making it a popular choice for digital electronics.

Technical Specifications

Bus Driver & Transceivers SNJ54F373W attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

F/FAST

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

Length:

13.09 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.54 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.92 mm

Trade Compliance

SNJ54F373W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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