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SNJ54F153J

Texas Instruments

SNJ54F153J by Texas Instruments

SNJ54F153J by Texas Instruments is a TTL multiplexer with 2 functions, 4 inputs, and 12 ns propagation delay. It operates at a supply voltage of 5V and has a max power supply current of 20mA. Ideal for military applications due to MIL-PRF-38535 screening level and ceramic package material.

Median Price

$4.286

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Freelance Electronics

USA . 7 parts In-Stock

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$4.286

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$4.500

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Vyrian

USA . 6,484 parts In-Stock

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Electro Mavin

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Resion

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Mil-Aero Solutions, Inc.

USA . 10 parts In-Stock

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Electronic Expediters

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GSS - Global Semi Support

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AZTECH Wire

Italy . 418 parts In-Stock

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Parana Technologies

USA . 475 parts In-Stock

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$24.855

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$2,308.167

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$22.370

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DigiPath Technology Company

USA . 2,372 parts In-Stock

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ChromeModa Solutions

Germany . 4,363 parts In-Stock

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IDEA Electronic Components Group

UK . 2,183 parts In-Stock

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One Stop Electronics

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Microchip USA

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Overview

Enhance your electronic projects with the Texas Instruments SNJ54F153J multiplexer & demultiplexer. Crafted with precision by a trusted manufacturer, this component offers unparalleled quality and reliability. Ideal for a variety of applications, this product streamlines your circuit design process and maximizes efficiency. Experience seamless functionality, superior performance, and exceptional value with the SNJ54F153J. Upgrade your projects today and unlock a world of possibilities with this advanced technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and reliability, making this product suitable for various operating conditions.

Propagation Delay At Nominal Supply: 12 ns

The low propagation delay at nominal supply voltage allows for quick and efficient signal processing, making this product ideal for high-speed applications.

No. of Functions: 2

Having multiple functions in one device increases functionality and versatility, making this product a cost-effective solution for multiplexing and demultiplexing tasks.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V ensures compatibility with existing systems and simplifies integration.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for industrial and military applications.

Technology: TTL

Using TTL technology provides fast switching speeds and low power consumption, making this product efficient and reliable for digital signal processing.

Technical Specifications

Multiplexer & Demultiplexer SNJ54F153J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SNJ54F153J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-463-5413, 5962014635413

NIIN

014635413

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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