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SNJ54F138FK

Texas Instruments

SNJ54F138FK by Texas Instruments

SNJ54F138FK by Texas Instruments is a TTL decoder with 9ns propagation delay, 20mA ICC, and 12ns tpd. It is used in military applications due to its MIL-PRF-38535 screening level and operates within -55 to 125 °C temperature range.

Median Price

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Lifecycle Status

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5

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1k+

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Vyrian

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Digiode

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Resion

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Holdelec - ElecDif-Pro

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PAR Electronics

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AZTECH Wire

Italy . 373 parts In-Stock

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One Stop Electronics

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Parana Technologies

USA . 1,614 parts In-Stock

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DigiPath Technology Company

USA . 1,350 parts In-Stock

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ChromeModa Solutions

Germany . 3,378 parts In-Stock

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IDEA Electronic Components Group

UK . 646 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,260 parts In-Stock

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Kepictronics

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Microchip USA

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Overview

Enhance your electronics projects with the SNJ54F138FK by Texas Instruments, a top-tier manufacturer known for high-quality components. This decoder & driver offers fast propagation delay and standard input conditioning, making it ideal for a wide range of applications. With military-grade screening and a compact chip carrier package style, this product delivers reliable performance in extreme conditions. Trust Texas Instruments for cutting-edge technology and superior products that bring value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures excellent durability and reliability, making this product suitable for harsh environments.

Propagation Delay At Nominal Supply: 9 ns

The low propagation delay ensures fast signal processing, making this decoder and driver efficient for time-sensitive applications.

Surface Mount: YES

The surface mount capability makes installation and soldering convenient, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures, ideal for industrial and military applications.

Technical Specifications

Decoder & Drivers SNJ54F138FK attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS

Family:

F/FAST

Input Conditioning:

STANDARD

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ54F138FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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