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SNJ54BCT8373AFK

Texas Instruments

SNJ54BCT8373AFK by Texas Instruments

SNJ54BCT8373AFK by Texas Instruments is an 8-bit bus driver with a propagation delay of 9.5 ns at 5V, suitable for military applications. It features a max frequency of 20 MHz, operates in temperatures ranging from -55 to 125°C, and has a power supply current of 52 mA.

Median Price

$84.295

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 42 parts In-Stock

1+ parts

-

100+ parts

$84.295

1k+ parts

$78.177

10k+ parts

$73.140

42

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$84.295

$78.177

$73.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 47 parts In-Stock

1+ parts

$54.000

100+ parts

$47.768

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47

$54.000

$47.768

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Vyrian

USA . 4,220 parts In-Stock

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4,220

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Digiode

USA . 3,774 parts In-Stock

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3,774

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Microfarads

USA . 46 parts In-Stock

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46

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LWI Electronics Inc

India . 20 parts In-Stock

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20

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Distributors (Availability)

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Andel Nordic

Denmark . 852 parts In-Stock

1+ parts

$3.458

100+ parts

-

1k+ parts

$3.319

10k+ parts

$3.319

852

$3.458

-

$3.319

$3.319

Parana Technologies

USA . 715 parts In-Stock

1+ parts

$10.458

100+ parts

-

1k+ parts

$10.971

10k+ parts

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715

$10.458

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$10.971

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DigiPath Technology Company

USA . 1,304 parts In-Stock

1+ parts

$11.515

100+ parts

$10.594

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1,304

$11.515

$10.594

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ChromeModa Solutions

Germany . 1,699 parts In-Stock

1+ parts

$11.750

100+ parts

$9.635

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1,699

$11.750

$9.635

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IDEA Electronic Components Group

UK . 1,484 parts In-Stock

1+ parts

$11.750

100+ parts

$11.162

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$10.575

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1,484

$11.750

$11.162

$10.575

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AZTECH Wire

Italy . 889 parts In-Stock

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$12.230

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Corphita

USA . 4,693 parts In-Stock

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4,693

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Microchip USA

USA . 2,054 parts In-Stock

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Overview

Enhance your electronic designs with the top-notch quality and reliability of the Texas Instruments SNJ54BCT8373AFK Bus Driver & Transceivers. With a MILITARY-grade screening level and advanced BICMOS technology, this chip carrier package offers unmatched performance in a variety of applications. Whether you're working on communication systems or industrial machinery, the SNJ54BCT8373AFK delivers fast propagation delay, low power consumption, and high output frequency capabilities. Trust Texas Instruments to provide cutting-edge solutions for your projects, ensuring efficiency and precision every step of the way.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material provides high reliability and durability for the product, making it suitable for rugged environments.

Propagation Delay at Nominal Supply: 9.5 ns

Low propagation delay ensures fast signal processing, making this product ideal for applications requiring quick response times.

No. of Bits: 8

With 8 bits, this bus driver & transceiver can handle a wide range of data, making it versatile for various communication or control tasks.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage, this product can easily integrate into existing systems without the need for additional power conversion.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh conditions and operate reliably in industrial or military environments.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers SNJ54BCT8373AFK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

S-CQCC-N28

JESD-609 Code:

e0

Length:

11.43 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

52 mA

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Translation:

N/A

Width:

11.43 mm

Trade Compliance

SNJ54BCT8373AFK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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