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SNJ54BCT646FK

Texas Instruments

SNJ54BCT646FK by Texas Instruments

SNJ54BCT646FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 10.5 ns at 5V, featuring a MILITARY temperature grade and TRUE output polarity. With a max operating temperature of 125°C, it is ideal for applications requiring INDEPENDENT CONTROL and POSITIVE EDGE triggering in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,515 parts In-Stock

1+ parts

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8,515

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Digiode

USA . 3,037 parts In-Stock

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3,037

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,396 parts In-Stock

1+ parts

$2.246

100+ parts

-

1k+ parts

$2.156

10k+ parts

$2.156

3,396

$2.246

-

$2.156

$2.156

AZTECH Wire

Italy . 602 parts In-Stock

1+ parts

$19.487

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602

$19.487

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One Stop Electronics

USA . 869 parts In-Stock

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$25.000

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869

$25.000

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Parana Technologies

USA . 301 parts In-Stock

1+ parts

$26.841

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$29.083

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301

$26.841

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$29.083

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DigiPath Technology Company

USA . 1,770 parts In-Stock

1+ parts

$29.555

100+ parts

$27.190

1k+ parts

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1,770

$29.555

$27.190

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ChromeModa Solutions

Germany . 353 parts In-Stock

1+ parts

$30.158

100+ parts

$24.730

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353

$30.158

$24.730

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IDEA Electronic Components Group

UK . 271 parts In-Stock

1+ parts

$30.158

100+ parts

$28.650

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$27.142

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271

$30.158

$28.650

$27.142

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Microchip USA

USA . 2,851 parts In-Stock

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Corphita

USA . 805 parts In-Stock

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805

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Overview

Discover the superior quality and reliability of the Texas Instruments SNJ54BCT646FK, a top-of-the-line Bus Driver & Transceiver chip that offers exceptional performance in a wide range of applications. With a MILITARY-grade screening level and a maximum operating temperature of 125°C, this chip is built to last in even the most demanding environments. Benefit from fast propagation delay, low power consumption, and independent control features that provide unparalleled value to customers looking for top-notch electronic components. Trust Texas Instruments for cutting-edge technology that delivers on both quality and performance.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures high durability and reliability, making the product suitable for rugged environments.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast and efficient operation, making this product ideal for applications requiring quick response times.

Surface Mount: YES

Being surface mountable simplifies the installation process and saves space on the PCB.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data processing tasks.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes integration into existing systems easier.

Power Supplies (V): 5

Having a consistent supply voltage of 5V ensures stable operation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Output Characteristics: 3-STATE

3-state outputs provide flexibility in the signal control, allowing for multi-drop bus configurations.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures makes this product suitable for a wide range of environments.

Technology: BICMOS

Utilizing BiCMOS technology offers a balance between high-speed performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers SNJ54BCT646FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

DIRECTION CONTROL; SELECT INPUT FOR MULTIPLEXED TRANSMISSION OF REGISTERED/ REAL TIME DATA

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

S-CQCC-N28

JESD-609 Code:

e0

Length:

11.43 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

67 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

12.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

11.43 mm

Trade Compliance

SNJ54BCT646FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-654-1879, 5962016541879

NIIN

016541879

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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