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SNJ54BCT574J

Texas Instruments

SNJ54BCT574J by Texas Instruments

SNJ54BCT574J by Texas Instruments is an 8-bit bus driver with a propagation delay of 11.2 ns at 5V, suitable for military applications. It features a max frequency of 77MHz, operates in a temperature range from -55 to 125°C, and has a power supply current of 62mA.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,772 parts In-Stock

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Digiode

USA . 287 parts In-Stock

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Andel Nordic

Denmark . 1,791 parts In-Stock

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$2.791

100+ parts

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$2.679

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$2.679

1,791

$2.791

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$2.679

$2.679

AZTECH Wire

Italy . 582 parts In-Stock

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$8.434

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One Stop Electronics

USA . 571 parts In-Stock

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$13.000

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Parana Technologies

USA . 1,759 parts In-Stock

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$27.448

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$35.932

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$35.932

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DigiPath Technology Company

USA . 1,021 parts In-Stock

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$30.223

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$27.805

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$30.223

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ChromeModa Solutions

Germany . 1,438 parts In-Stock

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$30.840

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$25.289

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IDEA Electronic Components Group

UK . 317 parts In-Stock

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$30.840

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$29.298

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$27.756

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Corphita

USA . 1,992 parts In-Stock

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Microchip USA

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Overview

Unleash the power of reliable and high-quality bus drivers & transceivers with the SNJ54BCT574J by Texas Instruments. Designed with precision and durability, this product offers unparalleled performance for a wide range of applications. From military to industrial use, this versatile component ensures smooth data transmission and efficient operation. Upgrade your systems with confidence, knowing that Texas Instruments delivers superior technology that exceeds expectations. Experience the value and benefits of the SNJ54BCT574J today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-term reliability and stability.

Propagation Delay At Nominal Supply: 11.2 ns

Fast propagation delay helps in quick communication and response times, making it suitable for high-speed bus applications.

Screening Level: MIL-PRF-38535

Complies with military standards for quality and reliability, making it ideal for critical applications where performance is crucial.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and integration into different systems and setups.

No. of Bits: 8

Provides compatibility with standard bus systems and protocols, making it a versatile choice for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with common power sources.

Load Capacitance (CL): 50 pF

Suitable for driving communication lines with moderate capacitive loads.

Power Supplies (V): 5

Consistent power supply voltage for stable operation and performance.

No. of Terminals: 20

Provides multiple connection points for interfacing with other components and systems.

Maximum I (ol): 48 Amp

Capable of driving high output currents, making it suitable for driving bus lines.

Minimum Operating Temperature: -55 °C

Operates reliably in extreme cold temperatures, suitable for a wide range of environments.

Maximum Frequency At Nominal Supply: 77000000 Hz

Supports high-frequency communication, making it suitable for high-speed bus applications.

Technology: BICMOS

Utilizes BICMOS technology for a balance of speed and power efficiency.

Technical Specifications

Bus Driver & Transceivers SNJ54BCT574J attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 374

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

77000000 Hz

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

62 mA

Propagation Delay At Nominal Supply:

11.2 ns

Propagation Delay (tpd):

11.2 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

SNJ54BCT574J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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