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SNJ54AHC373FK

Texas Instruments

SNJ54AHC373FK by Texas Instruments

SNJ54AHC373FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 10.5 ns, operating at a supply voltage of 3.3V. It features a MILITARY-grade temperature range and TRUE output polarity, suitable for applications requiring high-speed data transmission in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,799 parts In-Stock

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2,799

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Vyrian

USA . 2,729 parts In-Stock

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2,729

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Prism Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Andel Nordic

Denmark . 425 parts In-Stock

1+ parts

$3.629

100+ parts

-

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$3.484

10k+ parts

$3.484

425

$3.629

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$3.484

$3.484

AZTECH Wire

Italy . 756 parts In-Stock

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$18.452

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756

$18.452

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One Stop Electronics

USA . 1,108 parts In-Stock

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$26.000

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1,108

$26.000

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Parana Technologies

USA . 910 parts In-Stock

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$26.646

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$27.202

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910

$26.646

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$27.202

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DigiPath Technology Company

USA . 1,292 parts In-Stock

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$29.340

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$26.993

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1,292

$29.340

$26.993

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ChromeModa Solutions

Germany . 3,409 parts In-Stock

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$29.939

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$24.550

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3,409

$29.939

$24.550

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IDEA Electronic Components Group

UK . 329 parts In-Stock

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$29.939

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$28.442

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$26.945

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329

$29.939

$28.442

$26.945

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Corphita

USA . 4,154 parts In-Stock

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Microchip USA

USA . 1,275 parts In-Stock

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Enhance your electronic projects with the SNJ54AHC373FK from Texas Instruments, a top-tier manufacturer known for superior quality and reliability. This Bus Driver & Transceiver is ideal for a wide range of applications, offering seamless integration and efficient performance. With a MILITARY-grade temperature grade, TRUE output polarity, and 3-STATE output characteristics, this chip carrier package ensures optimal functionality in any setting. Experience the benefits of quick propagation delay, low power consumption, and versatile terminal positioning. Elevate your designs with the value and precision of Texas Instruments' SNJ54AHC373FK.

Feature Benefit Bullets

Package Body Material

This material ensures durability and reliability, making the product suitable for harsh environments.

Propagation Delay at Nominal Supply

The low propagation delay ensures quick data transmission, making the product efficient and responsive.

Nominal Supply Voltage / Vsup (V)

The nominal supply voltage is well within standard ranges, making the product compatible with various systems.

Maximum Operating Temperature

With a high maximum operating temperature, the product can withstand extreme conditions and maintain performance.

Output Characteristics

The 3-STATE output allows for a high level of flexibility and control in the system.

Technology

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the product.

Technical Specifications

Bus Driver & Transceivers SNJ54AHC373FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

SNJ54AHC373FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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