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SNJ54ACT74W

Texas Instruments

SNJ54ACT74W by Texas Instruments

SNJ54ACT74W by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, operating at 5V. It has a propagation delay of 14ns and can handle load capacitance of 50pF. Ideal for military applications due to MIL-PRF-38535 screening level and temperature range from -55°C to 125°C.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 672 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 8 parts In-Stock

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Electronics Depot

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First Choice Components Inc.

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Parana Technologies

USA . 743 parts In-Stock

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$19.256

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AZTECH Wire

Italy . 306 parts In-Stock

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ChromeModa Solutions

Germany . 5,618 parts In-Stock

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IDEA Electronic Components Group

UK . 14 parts In-Stock

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One Stop Electronics

USA . 637 parts In-Stock

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Corphita

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Microchip USA

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DigiPath Technology Company

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Overview

Enhance your electronic projects with the SNJ54ACT74W from Texas Instruments, a high-quality latches & flip-flops component that guarantees reliability and superior performance. Designed with precision and durability in mind, this product is ideal for a wide range of applications, offering customers unmatched value and benefits. Whether you're a hobbyist or a professional, trust in Texas Instruments to deliver top-notch products that will elevate your creations to the next level. Experience the excellence of Texas Instruments with the SNJ54ACT74W today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and reliability, making this product suitable for use in harsh environments.

No. of Functions: 2

Having 2 functions allows for increased functionality and flexibility in design applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is commonly used in electronic circuits, making this latch compatible with a wide range of devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this latch can withstand elevated temperatures without compromising performance.

Propagation Delay (tpd): 14 ns

The low propagation delay of 14 nanoseconds ensures fast response times, making this latch suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch energy-efficient and reliable.

Maximum Frequency At Nominal Supply: 85000000 Hz

The high maximum frequency capability of 85MHz allows for rapid data processing, making this latch ideal for applications requiring high-speed operation.

Technical Specifications

Latches & Flip-Flops SNJ54ACT74W attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-GDFP-F14

JESD-609 Code:

e0

Length:

9.21 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

85000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.285 mm

Minimum fmax:

85 MHz

Trade Compliance

SNJ54ACT74W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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