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SNJ54AC373W

Texas Instruments

SNJ54AC373W by Texas Instruments

SNJ54AC373W by Texas Instruments is an 8-bit bus driver with a propagation delay of 16.5 ns at 3.3V, suitable for military-grade applications. It features a 3-STATE output and operates in temperatures ranging from -55 to 125°C, making it ideal for high-reliability systems requiring fast signal transmission. With a flatpack package style and dual terminal position, this CMOS technology device offers efficient performance in compact designs.

Median Price

$18.320

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 70 parts In-Stock

1+ parts

$18.320

100+ parts

-

1k+ parts

-

10k+ parts

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70

$18.320

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-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 765 parts In-Stock

1+ parts

$17.404

100+ parts

-

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-

765

$17.404

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Vyrian

USA . 6,118 parts In-Stock

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6,118

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 25 parts In-Stock

1+ parts

$4.898

100+ parts

-

1k+ parts

$4.702

10k+ parts

$4.702

25

$4.898

-

$4.702

$4.702

AZTECH Wire

Italy . 1,079 parts In-Stock

1+ parts

$9.620

100+ parts

-

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1,079

$9.620

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Corphita

USA . 4,912 parts In-Stock

1+ parts

$16.488

100+ parts

-

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4,912

$16.488

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Parana Technologies

USA . 225 parts In-Stock

1+ parts

$27.702

100+ parts

$2,572.564

1k+ parts

$24.932

10k+ parts

-

225

$27.702

$2,572.564

$24.932

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DigiPath Technology Company

USA . 820 parts In-Stock

1+ parts

$30.503

100+ parts

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10k+ parts

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820

$30.503

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ChromeModa Solutions

Germany . 5,166 parts In-Stock

1+ parts

$31.126

100+ parts

$25.523

1k+ parts

-

10k+ parts

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5,166

$31.126

$25.523

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IDEA Electronic Components Group

UK . 1,327 parts In-Stock

1+ parts

$31.126

100+ parts

$29.570

1k+ parts

$28.013

10k+ parts

-

1,327

$31.126

$29.570

$28.013

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Microchip USA

USA . 2,906 parts In-Stock

1+ parts

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2,906

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Overview

Enhance your electronic projects with the SNJ54AC373W by Texas Instruments, a high-quality bus driver and transceiver that offers exceptional reliability and performance. Manufactured by Texas Instruments, a trusted name in the industry, this product is ideal for a wide range of applications. With a nominal supply voltage of 3.3V and advanced technology, this component provides value and benefits to customers looking for seamless integration and efficient operation. Upgrade your designs with the SNJ54AC373W and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and reliability of the product, making it suitable for rugged environments.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V allows for compatibility with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C enables the product to function effectively in harsh temperature conditions.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity, making it energy-efficient and reliable.

Control Type: ENABLE LOW

The enable low control type feature provides flexibility in managing the operation of the product, allowing for efficient use of resources.

Technical Specifications

Bus Driver & Transceivers SNJ54AC373W attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

Length:

13.09 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

16.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.92 mm

Trade Compliance

SNJ54AC373W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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